Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field

Hammad, A.E.; El-Molla, Sara; El‐Rehim, A. F. Abd; Ragab, M.

doi:10.1088/2053-1591/ac1c35

Cited by 4 publications

(3 citation statements)

References 75 publications

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“…Wei et al [ 49 ] reported the same three phases for the Sn–3.7 wt% Ag–0.9 wt% Zn alloy. In a study with the ternary Sn–2 wt% Ag–2 wt% Zn alloy, Hammad et al [ 50 ] observed similar XRD patterns as compared to those presented here, identifying the β‐Sn, Ag 3 Sn, ζ‐AgZn, and Ag 5 Zn 8 phases.…”

Section: Resultssupporting

confidence: 81%

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

et al. 2022

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Sn-Ag-based alloys are considered good alternatives to soldering operations as compared with the traditional Sn-Pb solder alloys. Herein, the effects of 0.5 and 1.0 wt% Zn additions to a Sn-3.5 wt% Ag eutectic alloy on cooling and growth rates, microstructure, and microhardness along the length of directionally solidified (DS) castings are examined. Characterization techniques such as optical microscopy (OM), scanning electron microscopy (SEM), X-ray fluorescence (XRF), X-ray diffraction (XRD), and Vickers microhardness are used to examine different samples extracted along the length of the DS castings. The Sn-3.5 wt% Ag alloy is shown to have a fully dendritic microstructure, characterized by a Sn-rich matrix with the eutectic mixture located in the interdendritic regions. On the other hand, the alloy modified with 1 wt% Zn exhibits a microstructure entirely formed by β-Sn cells, with a mixture of β-Sn, ε-Ag 3 Sn, and ζ-AgZn phases in the intercellular regions. The DS Sn-3.5 wt% Ag-0.5 wt% Zn alloy casting exhibits a cellular/dendritic transition at a critical cooling rate of 8.5 °C s À1 . The 0.5 wt% and 1 wt% Zn additions to the Sn-3.5 wt% Ag alloy improve hardness by 42.6% and 47.5%, respectively.

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Section: Resultssupporting

confidence: 81%

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

et al. 2022

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“…In detail, the experiment and apparatus were explained in references. 16,42 Alloy compositions were analyzed by the x-ray fluorescence (XRF) analytical technique, as shown in Table 1. SAC205 and SAC205-B samples were annealed for 30 min at 130 °C before being naturally air-cooled to room temperature.…”

Section: Methodsmentioning

confidence: 99%

“…[11][12][13] Furthermore, thermal and creep features are known as the most controlling deformations to expect the reliability, lifetime, and microstructure analysis of advanced interconnection solder alloys. [14][15][16][17] Moreover, creep occurrence is considered a great challenge in industrial applications. Thus, understanding the creep properties of a material can help predict its lifetime and recognize the breakdown behaviors of microelectronic packages.…”

Section: Introductionmentioning

confidence: 99%

Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy

Hammad

El-Molla

Ragab

2022

Proceedings of the Institution of Mechanical Engineers, Part L:

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Recently, the application of the magnetic field during the solidification process of alloys has become of great interest, owing to its ability to enhance microstructures. Hence, the present work aims to study the impact of a rotating magnetic field on the microstructure, thermal, and creep properties of the Sn–2.0Ag–0.5Cu (SAC205) alloy during solidification. Results demonstrated that applying a rotary magnetic field homogenized the distribution of intermetallic compounds and improved the microstructure. Additionally, the magnetic field diminished undercooling from 22.5 oC to 11.4 oC, indicating that the magnetic field is very useful in enhancing the microstructure and the alloy’s reliability. The pasty range values for SAC205 and SAC205-B were 7.2 oC and 8.6 oC lower than 11.0 oC for lead-tin, leading to a reduction of the alloy porosity. The SAC205-B alloy exhibited the longest creep rupture time of 158.5% compared to the SAC205. The n values of SAC205-B were higher than those of SAC205. Consequently, the SAC205-B alloy displayed the highest creep resistance and lowest creep rate (28.53%) compared to the SAC205. The Q values were 51.2 and 67.5 kJ/mol for SAC205 and SAC205-B, respectively, controlled by pipe diffusion. This research will provide practical advice for the manufacture of the solder alloy.

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Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

Dele‐Afolabi

Ansari

Hanim

et al. 2023

Journal of Materials Research and Technology

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Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field

Cited by 4 publications

References 75 publications

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

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