Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy
Abstract:Recently, the application of the magnetic field during the solidification process of alloys has become of great interest, owing to its ability to enhance microstructures. Hence, the present work aims to study the impact of a rotating magnetic field on the microstructure, thermal, and creep properties of the Sn–2.0Ag–0.5Cu (SAC205) alloy during solidification. Results demonstrated that applying a rotary magnetic field homogenized the distribution of intermetallic compounds and improved the microstructure. Addit… Show more
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