Progress of nanopositioning and nanomeasuring machines for cross-scale measurement with sub-nanometre precision

Manske, Eberhard; Fröhlich, Thomas; Füßl, Roland; Ortlepp, Ingo; Mastylo, Rostyslav; Blumröder, Ulrike; Dontsov, Denis; Kühnel, Michael; Köchert, Paul

doi:10.1088/1361-6501/ab848c

Cited by 30 publications

(20 citation statements)

References 37 publications

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“…Compared to tactile measurement instruments and scanning probe microscopes, CSI and CSM are faster and contactless. Such optical sensors providing high axial and lateral resolution are for example needed for nanopositioning and nanomeasuring technology [9,10] or measurements of surface properties of silica waveguides such as surface roughness [5] and side wall angles [6].…”

Section: Introductionmentioning

confidence: 99%

Rigorous 3D modeling of confocal microscopy on 2D surface topographies

Pahl

Hagemeier

Bischoff

et al. 2021

Meas. Sci. Technol.

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Although optical 3D topography measurement instruments are widespread, measured profiles suffer from systematic deviations occurring due to the wave characteristics of light. These deviations can be analyzed by numerical simulations. We present a 3D modeling of the image formation of confocal microscopes. For this, the light-surface interaction is simulated using two different rigorous methods, the finite element method and the rigorous coupled-wave analysis. The image formation in the confocal microscope is simulated using a Fourier optics approach. The model provides high accuracy and advantages with respect to the computational effort as a full 3D model is applied to 2D structures and the lateral scanning process of the confocal microscope is considered without repeating the time consuming rigorous simulation of the scattering process. The accuracy of the model is proved considering different deterministic surface structures, which usually cause strong systematic deviations in measurement results. Further, the influences of apodization and a finite pinhole size are demonstrated.

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Section: Introductionmentioning

confidence: 99%

Rigorous 3D modeling of confocal microscopy on 2D surface topographies

Pahl

Hagemeier

Bischoff

et al. 2021

Meas. Sci. Technol.

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“…Calculate the standard deviation s u(y) of the average value of u(y (1) ),u(y (2) ),…,u(y (h) );Standard deviation s ylow of the mean value of y (1) low ,y (2) low ,...,y (h) low ; And the standard deviation s yhigh of the average value of y (1) high ,y (2) high ,...,y…”

Section: Determine the Measurement Model Input Distribution And Proba...mentioning

confidence: 99%

“…In the design and development of the micro/nano coordinate measuring machine (CMM), the measurement framework is used to realize 3D precision measurement, so it is an important part of micro/nano measuring machine. The measurement frame of the CMM is usually formed by three laser interferometers arranged in the X, Y and Z measurement directions and a 3D target mirror that can reflect the laser beam [1]. The 3D target mirror is made up of three plane mirrors bonded together.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of measurement uncertainty of the orthogonal deviation angle of the target mirror based on AMCM

Huang

Guo

et al. 2022

J. Phys.: Conf. Ser.

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The combination of the three-dimensional (3D) target mirror and laser interferometers can achieve 3D precision measurement, and the orthogonality between the target mirror has a significant impact on the accuracy of the measurement system. In order to ensure the accuracy of the measurement system, it is necessary to measure the orthogonal deviation angle of the 3D target mirror and evaluate the uncertainty to verify whether the machining accuracy of the target mirror meets the requirements. In this paper, to test the orthogonality of the X-Y reflection planes of the 3D target mirror, which is glued by three plane mirrors, the evaluation methods of measurement uncertainty of the orthogonal deviation angle θxy are studied. The measurement model of uncertainty evaluation is built based on the quantitative characteristics analysis method, and the evaluation results of measurement uncertainty are obtained based on the adaptive Monte Carlo method (AMCM). Moreover, the evaluation results are compared with those evaluation results obtained respectively based on the traditional assessment method of measurement uncertainty (called as GUM method) and Monte Carlo method (MCM). Through the comparison of the evaluation results, it can be concluded that the best estimate of the orthogonal deviation angle θxy is about -3.09”, the corresponding standard uncertainty is about 0.69”, and the machining accuracy of the X-Y reflection planes of the target mirror meets the requirements. Moreover, the AMCM evaluation results is reliable, and AMCM is more convenient and efficient than GUM and MCM methods. The research work provides valuable reference for solving practical measurement evaluation problems.

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“…Experiments with the NPM machines revealed that in addition to the measuring capabilities, their positioning properties are excellent as well. The machines have an enormous position resolution of down to 5 pm, an ultra low position noise, trajectory deviations in the single nanometer range, and virtually no overshoot during changes in direction or when approaching a certain position [36,39]. Therefore, the NPM machines of the Technische Universität Ilmenau are perfect tools for the fabrication of 2D and 3D nanostructures in the size of a wafer.…”

Section: State Of the Artmentioning

confidence: 99%

Tip- and Laser-based 3D Nanofabrication in Extended Macroscopic Working Areas

et al. 2021

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The field of optical lithography is subject to intense research and has gained enormous improvement. However, the effort necessary for creating structures at the size of 20 nm and below is considerable using conventional technologies. This effort and the resulting financial requirements can only be tackled by few global companies and thus a paradigm change for the semiconductor industry is conceivable: custom design and solutions for specific applications will dominate future development (Fritze in: Panning EM, Liddle JA (eds) Novel patterning technologies. International society for optics and photonics. SPIE, Bellingham, 2021. 10.1117/12.2593229). For this reason, new aspects arise for future lithography, which is why enormous effort has been directed to the development of alternative fabrication technologies. Yet, the technologies emerging from this process, which are promising for coping with the current resolution and accuracy challenges, are only demonstrated as a proof-of-concept on a lab scale of several square micrometers. Such scale is not adequate for the requirements of modern lithography; therefore, there is the need for new and alternative cross-scale solutions to further advance the possibilities of unconventional nanotechnologies. Similar challenges arise because of the technical progress in various other fields, realizing new and unique functionalities based on nanoscale effects, e.g., in nanophotonics, quantum computing, energy harvesting, and life sciences. Experimental platforms for basic research in the field of scale-spanning nanomeasuring and nanofabrication are necessary for these tasks, which are available at the Technische Universität Ilmenau in the form of nanopositioning and nanomeasuring (NPM) machines. With this equipment, the limits of technical structurability are explored for high-performance tip-based and laser-based processes for enabling real 3D nanofabrication with the highest precision in an adequate working range of several thousand cubic millimeters.

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Progress of nanopositioning and nanomeasuring machines for cross-scale measurement with sub-nanometre precision

Cited by 30 publications

References 37 publications

Rigorous 3D modeling of confocal microscopy on 2D surface topographies

Rigorous 3D modeling of confocal microscopy on 2D surface topographies

Evaluation of measurement uncertainty of the orthogonal deviation angle of the target mirror based on AMCM

Tip- and Laser-based 3D Nanofabrication in Extended Macroscopic Working Areas

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