2017
DOI: 10.1515/nanoph-2016-0004
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Progress in ultrafast laser processing and future prospects

Abstract: Abstract:The unique characteristics of ultrafast lasers have rapidly revolutionized materials processing after their first demonstration in 1987. The ultrashort pulse width of the laser suppresses heat diffusion to the surroundings of the processed region, which minimizes the formation of a heat-affected zone and thereby enables ultrahigh precision micro-and nanofabrication of various materials. In addition, the extremely high peak intensity can induce nonlinear multiphoton absorption, which extends the divers… Show more

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Cited by 172 publications
(82 citation statements)
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References 161 publications
(197 reference statements)
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“…A mode-locked Ti:sapphire laser (120 fs pulse duration, 1 kHz repetition rate) operating at a wavelength of 800 nm is used for the femtosecond laser direct writing. [26] As shown in Figure 1b, the laser beam in Gaussian mode is focused via 50Â microscope objective (numerical aperture is 0.55, Nikon ECLIPSE 80i) onto the sample at a scan speed of 100 μm s À1 , which are placed on the XYZ piezo-translation stage. The planar-patterned heterostructures are created by focusing laser pulses on the surface with the beam spot around 2 μm.…”
mentioning
confidence: 99%
“…A mode-locked Ti:sapphire laser (120 fs pulse duration, 1 kHz repetition rate) operating at a wavelength of 800 nm is used for the femtosecond laser direct writing. [26] As shown in Figure 1b, the laser beam in Gaussian mode is focused via 50Â microscope objective (numerical aperture is 0.55, Nikon ECLIPSE 80i) onto the sample at a scan speed of 100 μm s À1 , which are placed on the XYZ piezo-translation stage. The planar-patterned heterostructures are created by focusing laser pulses on the surface with the beam spot around 2 μm.…”
mentioning
confidence: 99%
“…This distinct feature offers three different schemes in 3D micro-and nanoprocessing, subtractive, undeformative, and additive processing. 27 As described in the article by Jiang et al in this issue, several products are available that take advantage of ultrafast laser 3D densifi cation that occurs in glasses that allow these regions to etch far more quickly than others. This has spawned the fi eld of glass MEMS devices.…”
Section: Opportunities For Transparent Materials and Organic Materialsmentioning
confidence: 99%
“…Laser processing is an effective and attractive method for surface modification of various materials, including surface texturing of semiconductors [1,2], corrosion prevention in biocompatible metals [3,4], and surface polishing of optical glass [5,6]. Employing CO 2 laser melting in a non-evaporative regime has enabled us to obtain surfaces of optical glass with a roughness smaller than 0.1 nm at a rapid processing rate of up to 5 cm 2 /s [5].…”
Section: Introductionmentioning
confidence: 99%