Progress in the chemistry of organosilicon resists

Abstract

Recent developments in the chemistry of organosilicon polymers for use as oxygen plasma‐resistant imaging materials in microlithography are reviewed. Various classes of resists, grouped according to molecular structure, are described with special emphasis on properties critical in microlithographic applications. In addition, several silylation schemes involving selective silylation of a non‐silicon‐containing resist material following patternwise exposure to actinic radiation are also described.

Preparation of Thermoresponsive Grafted Polysilsesquioxane from Polyacrylamides Having Methoxysilyl End Group

“…1 H NMR and 13 C NMR spectra were obtained on a JEOL AL-300 and JNM A-500 spectrometer in CDCl 3 or DMSO-d 6 . IR spectra were recorded on a JASCO FT/IR 230.…”

“…[1][2][3][4][5] In fact, the applications of such silsesquioxanes have been extended to electrical, optical, mechanical, and chemical fields. [6][7][8][9] Most of those are performed by the modification of organic functional group, which is contained in the starting trialkoxy-or trichloro-silanes. The graft polymerization onto and from the silsesquioxane main chain has been also recognized as an effective method for the modification, in which the polymeric component provides an additional property besides durability for heat and weatherability based on the inorganic polysiloxane backbone.…”

Synthesis of thermoresponsive polysilsesquioxane with methoxyethylamide group and crown ether

“…5-8 PSQ has been investigated for possible applications in various contexts, such as electrical, optical, mechanical and chemical uses. [9][10][11] This range of applications is made possible by the modification of the organic functional group, which is contained in the starting trialkoxyor trichlorosilanes. Graft polymerizations onto and from the PSQ main chain are one of the most effective methods of making modifications, in which the polymeric component provides an additional property besides durability for heat and weatherability based on the inorganic polysiloxane backbone.…”

Photopatternable thin films from silyl hydride containing silicone resins and photobase generators

“…The high sensitivity of these materials stems from the incorporation of a light-sensitive latent catalyst into a catalytically sensitive matrix. [1,2]. The active catalyst proceeds to catalyze chemical reactions that result in a change in the solubility of the base material, either through chemical modification or crosslinking.…”