2001
DOI: 10.1016/s0040-6090(00)01668-0
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Production of Nb thin film by ECR sheet plasma

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Cited by 12 publications
(3 citation statements)
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“…在等离子体发生装置中, 由于电子的运动速度 远大于离子, 器壁上会累积大量负电荷, 正电荷则 会聚集在器壁附近形成正空间电荷层, 这个非中性 区域被称为等离子体鞘层 [1] , 其厚度相当于十几个 电子德拜长度. 自1929年Langmuir [2] 首次提出鞘 层概念以来, 鞘层就成为等离子体物理学中的一个 重要研究热点, 其特性广泛应用于各行业, 如等离 子体材料表面改性 [3][4][5] 、探针测量 [6] 、薄膜沉积 [7] 和 离子体蚀刻 [8][9][10] 等方面, 等离子体鞘层中的电场分 布、带电粒子的密度分布、鞘层厚度以及入射到待 加工工件表面上的粒子能量分布等都直接影响等 离子体蚀刻和膜沉积的工艺质量 [11,12] .…”
Section: 引 言unclassified
“…在等离子体发生装置中, 由于电子的运动速度 远大于离子, 器壁上会累积大量负电荷, 正电荷则 会聚集在器壁附近形成正空间电荷层, 这个非中性 区域被称为等离子体鞘层 [1] , 其厚度相当于十几个 电子德拜长度. 自1929年Langmuir [2] 首次提出鞘 层概念以来, 鞘层就成为等离子体物理学中的一个 重要研究热点, 其特性广泛应用于各行业, 如等离 子体材料表面改性 [3][4][5] 、探针测量 [6] 、薄膜沉积 [7] 和 离子体蚀刻 [8][9][10] 等方面, 等离子体鞘层中的电场分 布、带电粒子的密度分布、鞘层厚度以及入射到待 加工工件表面上的粒子能量分布等都直接影响等 离子体蚀刻和膜沉积的工艺质量 [11,12] .…”
Section: 引 言unclassified
“…Among the many physical characteristics of plasma discharges, the plasma sheath stands out as a critical component in most plasma experiments and industrial processes, and due to its complicated and variable structure, attempts to construct and simulate physical models of the plasma sheath have attracted widespread interest and research over the past decades [1][2][3][4][5][6][7][8][9][10]. Generally, when a plasma is adjacent to the container wall or material surface, a region of potential inhomogeneity is an inevitable result, since the ions have a substantially higher mass than the electrons and the electron mobility is at least two orders of magnitude greater than that of the ions, which results in the accumulation of negative charges on the wall and a negative potential in comparison to the bulk plasma.…”
Section: Introductionmentioning
confidence: 99%
“…As a non-neutral transition region, the plasma sheath is closely related to various chemical and physical processes. A thorough examination of the sheath properties is essential for understanding the interactions between the plasma and wall in industrial processes such as thin film deposition, surface modification, plasma etching, sputtering, microelectronics, spacecraft propulsion, fusion energy, etc [4][5][6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%