Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection

Zhang, X.P.; Yu, Chang-Ho; Zhang, Y.P.; Shrestha, Suman; Dorn, Lutz

doi:10.1016/j.jmatprotec.2007.04.072

Cited by 26 publications

(6 citation statements)

References 8 publications

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“…[6][7][8]. Among these alloys, Sn-Ag-based alloy is one of the most promising candidates for lead-free solders, which exhibits better ductility, higher strength and superior resistance to creep and thermal fatigue as compared with Pb-Sn eutectic alloy [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy

Zhu

Liu

Wang

et al. 2009

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy

Zhu

Liu

Wang

et al. 2009

Journal of Alloys and Compounds

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“…Therefore, the measurement of contact angle between solder and substrate is used to determine the extent of wetting, which is a very important issue in the reliability of electronic packaging. The reported values in the literature on the contact angle for lead-free solder alloys are quite disparate and hard to be compared with each other, mainly due to the different experimental conditions [8,11]. Another issue is the formation and growth of intermetallic compounds (IMCs) between solder and substrate, which is of great importance to the performance of lead-free solders [12].…”

mentioning

confidence: 99%

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

et al. 2010

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Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy's melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample's cross section. Intermetallic compounds of Cu 6 Sn 5 and β-Sn phase were found at the interface of Sn-Ag-Cu/Cu. contact angle, lead-free solder, sessile drop method, Sn-Ag-Cu, intermetallic compounds Citation:Zhang X R, Yuan Z F, Zhao H X, et al. Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate.There have been several regulations to ban Pb from electronic products all over the world. The European Union's RoHS directive is the initial driving force for the elimination of Pb because Pb contained in conventional solder materials has harmful influence on the environment and human health [1−6]. As a result, lead-free solders with microstructure stability and mechanical properties comparable with eutectic Pb-Sn solder stimulate immense interests in microelectronic application. Nowadays several lead-free solders including Sn-Ag, Sn-Cu, Sn-Zn, Sn-Ag-Bi and Sn-Ag-Cu systems have been developed. Among them, the near-ternary eutectic Sn-Ag-Cu system solders have been regarded as primary candidates because of their good mechanical and acceptable wetting properties as well as suitable melting points [7−10]. Wettability has been defined as the tendency for a liquid to spread on a solid surface, and it is optimized by minimizing the value of contact angle, which corresponds to lower surface-interfacial energy. Therefore, the measurement of contact angle between solder and substrate is used to determine the extent of wetting, which is a very important issue in the reliability of electronic packaging. The reported values in the literature on the contact angle for lead-free solder alloys are quite disparate and hard to be compared with each other, mainly due to the different experimental conditions [8,11]. Another issue is the formation and growth of intermetallic compounds (IMCs) between solder and substrate, which is of great importance to the performance of lead-free solders [12].The purpose of this work is to investigate the wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate. Contact angles were measured by sessile drop method, and the morphology of the interface of Sn-Ag-Cu/Cu was also investigated.

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“…The ultrafast heating and cooling rate and short soldering time of laser soldering significantly affect the interfacial reaction of solder joints, including thickness, morphology and size of the interfacial IMC particles and the microstructures of the solder alloy (Zhang et al , 2007; Takahashi et al , 2004; Nakahara et al , 2000; Tian et al , 2008; An et al , 2013; Chen et al , 2020; Nishikawa and Iwata, 2015a, 2015b; Kim et al , 2009; Lee et al , 2022). Zhang et al (2007) investigated the processing performance of Sn-Ag-Cu-Bi solder after rapid laser-beam reflowing and found that the strength and the creep resistance of the solder connections have been increased obviously after rapid laser-beam reflowing treatment due to grain refining effect and the Cu alloying effect.…”

Section: Introductionmentioning

confidence: 99%

Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering

Zhang

Chen

et al. 2023

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Purpose Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering. Design/methodology/approach In this study, the metallurgical and mechanical properties of the Sn3.0Ag0.5Cu/Ni-P joints after laser and reflow soldering and isothermal aging were compared and analyzed. Findings In the as-soldered Sn3.0Ag0.5Cu/Ni-P joints, a small granular and loose (Cu,Ni)6Sn5 intermetallic compound (IMC) structure was formed by laser soldering regardless of the laser energy, and a long and needlelike (Cu,Ni)6Sn5 IMC structure was generated by reflow soldering. During aging at 150°C, the growth rate of the IMC layer was faster by laser soldering than by reflow soldering. The shear strength of as-soldered joints for reflow soldering was similar to that of laser soldering with 7.5 mJ, which sharply decreased from 0 to 100 h for both cases and then was maintained at a similar level with increasing aging time. Originality/value Laser soldering with certain energy is effective for reducing the thickness of IMCs, and ensuring the mechanical property of the joints was similar to reflow soldering.

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Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection

Cited by 26 publications

References 8 publications

Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy

Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering

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