Abstract:Purpose
Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering.
Design/methodology/approach
In this study, the metallurgical and mechanical properties of the Sn3.0Ag0.5Cu/Ni-P joints after laser and reflow soldering and isothermal aging were compared and analyzed.
Findings
In the as-soldered Sn3.0Ag0.5Cu/Ni-P joints, a small gra… Show more
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