Printed Electronics on Flexible Substrate Using Inkjet Technology

Nishi, Shinichi; Asano, Kazuo; Ishibashi, Daisuke; Kitami, Akiko; Furuno, Kumiko

doi:10.5104/jiepeng.2.75

Cited by 5 publications

(5 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…To balance the perplexities brought about by this top‐down process, the other approach proposed is a bottom‐up process, which is to print the corresponding materials with the technique of assembling the rigid components and soft substrate in a single procedure . Several printing methods (e.g., inkjet printing, electrohydrodynamic printing, aerosol printing, direct ink writing (DIW), etc.) have been introduced to fabricate such soft devices.…”

Section: Introductionmentioning

confidence: 99%

Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics

Lin

Mao

et al. 2019

Adv Materials Technologies

View full text Add to dashboard Cite

of amalgamating rigid elements and nonstretchable components on a soft substrate, strain isolation is proposed as a promising strategy in order to fabricate stretchable devices by incorporating island-bridge structure for these stretchable electronics. [13,14] The original strain isolation is offered by the modulus contrast between rigid components and the soft substrate, but constricted by the materials participating and the thickness of each part, leading to delaminating at the interface created by the components and the substrate. Furthermore, enhanced strain isolation schemes exploit geometrically structured substrates, [15] elastomeric substrates with stiff platforms, [2,16] soft elastomers with liquid-filled cavities, [2,17] and polymer substrates with programmable rigidity. [18] However, these approaches make the fabrication arduous, prompting further problems. Utilizing geometrically structured substrates not only elevates the thickness of the entire device but the substrates need to be pre-strained as well, making the subsequent transfer printing process a taxing affair. Although stiff platforms embedded into elastomeric substrates can fortify brittle components, there is still an adequate chance of occurrence of delamination at the interface of stiff platforms and soft substrates. Liquid filled in cavities of soft elastomers is prone to leakage or evaporation. Considering the scheme of polymer substrate with programmable rigidity, aqueous solution oxidized substrate offers low spatial resolution despite adopting airlaid paper to absorb liquid and confine the oxidized regions. In addition, manual operations are involved in the process, thus curtailing the success rate as well as the efficiency of manufacturing. Hence, these scenarios demand a new method of lamination between rigid components and soft substrates to be developed, which could not only safeguard the brittle parts but also employ a novel process to streamline the preparation.The field of soft electronics boasts microfabrication as its conventional manufacturing method; but in order to create soft electronic devices, it must interweave other approaches with it, like transfer printing. [19,20] To balance the perplexities brought about by this top-down process, the other approach proposed is a bottom-up process, which is to print the corresponding materials with the technique of assembling the rigid components and soft substrate in a single procedure. [21] Several printing methods (e.g., inkjet printing, [22][23][24] electrohydrodynamic printing, [25][26][27] aerosol printing, [28,29] direct ink writing (DIW), [30,31] etc.) have been introduced to fabricate such soft The trend of incorporating soft electronic systems in current electronics framework is fast becoming a wide phenomenon in healthcare as they provide a more suitable human-machine interface making it conveniently possible to achieve real-time, continuous health monitoring and therapy. However, the effective integration of an entire system with the soft and dynamic human skin has prov...

show abstract

Section: Introductionmentioning

confidence: 99%

Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics

Lin

Mao

et al. 2019

Adv Materials Technologies

View full text Add to dashboard Cite

show abstract

“…However, there are some problems, such as the increase in temperature or acidic environment mediated by light, which still cannot be applied to biomaterials directly. Existing digital printing technology can solve the problems of these complicated processes and processing environment conditions; however, inkjet printing, , electrohydrodynamic printing, − and aerosol jet printing , have higher requirements on the viscosity of materials, whereas the viscosity range of biomaterials is wide and high viscosity may lead to blockage of printheads. Therefore, we adopt direct ink writing (DIW) technology based on the microextrusion method, which is more universal.…”

Section: Introductionmentioning

confidence: 99%

Introducing Temperature-Controlled Phase Transition Elastin-like Polypeptides to Transient Electronics: Realization of Proactive Biotriggered Electronics with Local Transience

Lin

Yan

Hao

et al. 2019

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

Transient electronics have dramatically changed inner-body therapy in health care. They stand out because of their harmless dissolution in the human body with no lingering electronic trash. However, high-precision biomedical implants require programmable and serial remedy operations, and controlling the whole-device destruction is not proactive and precise. Thus, a novel biotriggered and temperature-controlled transient electronics fabrication method using elastin-like polypeptides (ELPs) as triggers is proposed. Biocompatible ELPs simply mixed with trace silver nanowire (AgNW) can serve as the “switch” for the electronics to respond to local temperature changes in deionized water, exhibiting an agile response time. A ratio gradient experiment of the ELPs and AgNW shows that more programmable and precise transience properties (initial resistance, ready time, response time, and stable resistance) can be achieved by using a designated proportion. Further, we validated that the 3D-printing-based ELP-triggering transient electronics fabrication method is very simple yet effective for preparing transient wireless charging LEDs. Transient devices comprising ELPs-AgNW and PLGA-Ag respond within 160 s below 10 °C and degrade within a certain period.

show abstract

“…To this end, various efforts have been made. [1][2][3][4][5][6][7] Nomura and coworkers successfully ejected ink droplets whose viscosity was 100 mPa s using an ultrasonic inkjet system that ejects ink droplets by using a focused ultrasound. [8][9][10][11] This model focuses the ultrasonic waves emitted from the ultrasonic vibrator in the vicinity of the nozzle liquid surface and ejects ink droplets by the pressure of the sound wave.…”

Section: Introductionmentioning

confidence: 99%

Simulation of a liquid droplet ejection device using multi-actuator

Yoshino¹,

Yasuda²,

Tanuma³

2016

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

An equivalent circuit model for a liquid droplet ejection device using a multiactuator has been developed. The equivalent circuit was simplified using a gyrator in the synthesis of the outputs of many elements. The simulation was performed for an inkjet head having three piezoelectric elements using MATLAB/Simulink. In this model, the pressure chamber is filled with a Newtonian fluid. For this reason, the model assumed only the resistance component of the pressure chamber and the nozzle as a load. Furthermore, since the resistance component of the inlet is much larger than that of the nozzle, it is not considered in this model. As a result, by providing a time difference between the driving signals of the piezoelectric elements, we found that the pressure of the ink chamber could be arbitrarily controlled. By this model, it becomes possible to control the pressure in the ink chamber of the inkjet head required for the ejection of various inks.

show abstract

Printed Electronics on Flexible Substrate Using Inkjet Technology

Cited by 5 publications

References 1 publication

Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics

Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics

Introducing Temperature-Controlled Phase Transition Elastin-like Polypeptides to Transient Electronics: Realization of Proactive Biotriggered Electronics with Local Transience

Simulation of a liquid droplet ejection device using multi-actuator

Contact Info

Product

Resources

About