2020
DOI: 10.1080/00032719.2020.1803347
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Printed Circuit Board (PCB) Brazing and Ion Source Integration of a High-Field Asymmetric Ion Mobility Spectrometry (FAIMS) Chip

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Cited by 6 publications
(3 citation statements)
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“…The height of the brazing layer between the upper and lower plates was 0.2 mm. The corresponding surfaces of the upper and lower plates had copper‐coated U‐shaped grooves, 11 and the corresponding surfaces of the upper and lower plates had U‐shaped positioning slots with copper plating, which were enclosed between the two plates using brazing technology to form an enclosed space. The brazing layer, composed of solder paste, had good thermal conductivity.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The height of the brazing layer between the upper and lower plates was 0.2 mm. The corresponding surfaces of the upper and lower plates had copper‐coated U‐shaped grooves, 11 and the corresponding surfaces of the upper and lower plates had U‐shaped positioning slots with copper plating, which were enclosed between the two plates using brazing technology to form an enclosed space. The brazing layer, composed of solder paste, had good thermal conductivity.…”
Section: Methodsmentioning
confidence: 99%
“…Based on the structure of the original planar FAIMS, 11 this study combined an additional temperature control function with a UV lamp to test volatile organic compounds (VOC) such as acetone at different temperatures. The experimental results showed that the FAIMS system with temperature control can effectively suppress noise and improve the signal‐to‐noise detection ratio, and the detection signal's repeatability is improved.…”
Section: Introductionmentioning
confidence: 99%
“…At the same time, it has the characteristics of high speed and high precision. The PCB brazing FAIMS chip has been clearly described in our previous research 17 . The chip is based on a PCB brazing process FAIMS system board with a helium ventilation device added.…”
Section: Methodsmentioning
confidence: 99%