1988
DOI: 10.1179/mst.1988.4.8.669
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Principles of superplastic diffusion bonding

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Cited by 27 publications
(3 citation statements)
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“…This feature is mainly dependent on the grain size; the fine grained materials are more suitable for superplasticity as the creep mechanism is readily achieved. This contributes to bonding formation [26]. Although, dynamic grain growth was reported during superplastic deformation of the super α 2 alloy at 980…”
Section: Pressurementioning
confidence: 99%
“…This feature is mainly dependent on the grain size; the fine grained materials are more suitable for superplasticity as the creep mechanism is readily achieved. This contributes to bonding formation [26]. Although, dynamic grain growth was reported during superplastic deformation of the super α 2 alloy at 980…”
Section: Pressurementioning
confidence: 99%
“…The diffusion bonding is that metals are bonded by way of partial plastic deformation of bonded surfaces under the high temperature and pressure. Then, mutual diffusion of atoms between metals forms metallic bond so that the metals are tightly bonded [1][2]. Superplasticity of materials can accelerate the process of solid-state diffusion bonding, reduce diffusion bonding temperature and achieve good bonding properties.…”
Section: Introductionmentioning
confidence: 99%
“…To synthesize chemically clean planar interfaces by diffusion bonding, the substrate must be macroscopically and microscopically flat and chemically clean. 3 Macro-flatness, necessary for bonding to occur over large areas, was ensured by conventional mechanical polishing and lapping. Substrate surfaces were cleaned by a broad (3cm) 500 eV ion beam (Ar or Xe) at 15° incidence.…”
mentioning
confidence: 99%