Pretreatment of polymer surfaces—the crucial step prior to metal deposition

Schröer, D.; Nichols, Richard J.; Meyer, H.

doi:10.1016/0013-4686(95)00053-h

Cited by 28 publications

(32 citation statements)

References 6 publications

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“…Some literature report only increases in roughness due to sweller treatment. 23 For polymers with 1 Ӷ b/a 2 Ӷ 225 sweller treatment increases pore length ͑and rms roughness of the surface͒ at first and after reaching a maximum, the pore length lowers again. The ridge shape of the maximum roughness during oxidation as a function of sweller pretreatment time is reported by Ge et al 8 and Li and Tummala 4 and is also experienced in our own experiments.…”

Section: ͓38͔mentioning

confidence: 98%

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Kinetic Study of Wet Chemical Treatments on the Surface Roughness of Epoxy Polymer Layers for Buildup Layers

Siau

Vervaet

Nalines

et al. 2004

J. Electrochem. Soc.

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The adhesion of plated metal layers to epoxy polymer surfaces is of prime importance for the reliability of interconnections in microelectronics. An increase in the roughness of the polymer surface, caused by chemical treatment, plays an important part in the adhesion strength of plated metal layers by increasing the total area of interaction between both layers. This kinetic study of the influence of chemical treatments on the surface of the polymer consists of two parts. In Part I the kinetics of sweller treatments and of the solvent were examined in detail and a kinetic model for the influence of sweller and solvent was developed. In this second part the kinetics of the formation of roughness at the polymer surface due to oxidative liquid treatments is examined. A kinetic model is developed based on experimental studies, compromising the combined effects of sweller-oxidizer treatments and the influence of diffusion of the different components. A number of examples are given and verified by experiment. The roughness of the treated polymer samples is measured experimentally by atomic force microscopy. Time-dependant mass measurements were used to record mass changes due to diffusion and reaction.The continuing striving in microelectronics to miniaturize and/or the necessity for electronic circuits to operate in harsh environments, together with the increased signal frequencies and higher density of functions necessary, necessitates further advances in interconnection technologies. A prime requirement for these is a good adhesion between polymers and plated copper layers. It is obvious that the surface properties of the polymer have a big impact on the adhesion of the metal to the polymer. By chemical treatment of the surface the characteristics ͑physical and chemical͒ of it can be changed in order to improve adhesion. Hence there has been intense recent research into improving the adhesion of plated copper onto polymer surfaces.A number of publications 1-3 exist on surface treatments with wet chemicals to improve adhesion strength of copper on epoxy resins. These authors made a phenomenological study on copper laminated foils but not on plated copper surfaces. Li and Tummala 4 studied the effect of wet chemical pretreatments on the interfacial adhesion between plated copper layers and epoxy polymers. According to these authors adhesion between two layers depends first on the physical and mechanical adhesion, caused by the roughness between both layers, and second on the chemical adhesion which is caused by interactions between polymer molecules and the plated metal. These findings are based on earlier work described by Wake. 5 The effects of wet chemical treatments on interfacial adhesion and roughness has not been well studied and understood, 6,7 Recently Ge et al. 8 studied the influence of surface modification on epoxy/copper systems. According to these authors wet-chemical treatments produce a large number of microcavities to anchor deposited electroless copper. Mechanical interlocking was found to have a do...

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Section: ͓38͔mentioning

confidence: 98%

“…4,5,[8][9][10]23 According to the literature the maximum roughness achieved as a function of oxidation treatment time, which corresponds to region 2 of the curves of Fig. 12, can increase at least up to three times.…”

Section: ͓38͔mentioning

confidence: 99%

Kinetic Study of Wet Chemical Treatments on the Surface Roughness of Epoxy Polymer Layers for Buildup Layers

Siau

Vervaet

Nalines

et al. 2004

J. Electrochem. Soc.

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“…In recent years there have been many reported studies on the incorporation of metal particles within a conducting polymer matrix, such as polyaniline or polypyrrole [1][2][3][4][5][6][7]. This incorporation can be achieved readily by the reduction of the appropriate metal salt at the conducting polymer interface.…”

Section: Introductionmentioning

confidence: 99%

“…Johnson and co-workers [14,15] in studying the oxidation of glucose at a number of copper alloys have explained the enhanced oxidation at a Mn 5 Cu 95 in terms of the Mn sites functioning as Lewis acid sites for adsorption of the polar glucose molecule, while they have interpreted the oxidation at a Ni 10 Cu 90 alloy in terms of a redox-mediated mechanism. Marioli and Kuwana [20] have identified the interaction of the glucose with the oxide/hydroxide layer as an important step in the subsequent oxidation of the molecule.…”

Section: Introductionmentioning

confidence: 99%

Oxidation and photo-induced oxidation of glucose at a polyaniline film modified by copper particles

Farrell

Breslin

2004

Electrochimica Acta

115

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The oxidation and photo-induced oxidation of glucose at a copper-dispersed polyaniline film was studied in an alkaline hydroxide solution. It was found that the copper-dispersed polyaniline electrode was capable of oxidizing glucose at potentials between 0.2 and 0.75 V/(Ag|AgCl), with the rate of oxidation being higher than that observed at a bulk copper electrode. On irradiation of the composite with polychromatic UV light, a further increase in the rate of the glucose oxidation reaction was observed. Formate was identified as the main product of the glucose oxidation reaction under both light and dark conditions using 1 H NMR spectrometry. This suggests that illumination does not alter significantly the reaction pathway.

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“…[32][33][34][35][36][37] This incorporation can be achieved readily by the reduction of the appropriate metal salt at the conducting polymer interface. The interest in these materials lies in the fact that they are promising materials in the fields of catalysis and electrocatalysis.…”

mentioning

confidence: 99%

Electrochemical Analysis of H[sub 2]O[sub 2] and Nitrite Using Copper Nanoparticles/Poly(o-phenylenediamine) Film Modified Glassy Carbon Electrode

Kumar

Chen

2009

J. Electrochem. Soc.

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Copper nanoparticles ͑Cu-NPs͒ have been electrochemically synthesized onto a poly͑o-phenylenediamine͒ ͑PoPD-͒ coated glassy carbon electrode ͑GCE͒. Electrochemical properties and surface characterizations were studied using cyclic voltammetry, atomic force microscopy ͑AFM͒, scanning electron microscopy ͑SEM͒, and X-ray diffraction ͑XRD͒ analysis. Cyclic voltammetry, AFM, SEM, and XRD confirmed the presence of Cu-NPs on the electrode surface. Cu-NPs are firmly stabilized by surface attachment of the PoPD functionality that can be attached to the electrode surface, thus becoming an integral part of the polymer backbone. The Cu-NPs-polymer film-coated GCE ͑Cu-NPs/PoPD/GCE͒ showed excellent electrocatalytic activity toward the reduction of hydrogen peroxide ͑H 2 O 2 ͒ and nitrite ͑NO 2 − ͒. Amperometry was carried out to determine the concentration of H 2 O 2 and NO 2 − at Ϫ0.3 V. The dependence of the current response on the H 2 O 2 concentration was explored under neutral conditions, and an excellent linear concentration range from 1.0 ϫ 10 −6 to 1.0 ϫ 10 −3 M was found. The Cu-NPs/PoPD/GCE allows highly sensitive, low working potential, stable, and fast amperometric sensing of H 2 O 2 and NO 2 − . This is promising for the future development of nonenzymatic sensors. The real-sample analysis of commercial H 2 O 2 samples was performed using the proposed method, and the obtained results are satisfactory.Electrodes modified with nanoscale materials are widely used for the fabrication of chemical and biosensors. Because our aim is to prepare a reliable, reproducible, selective, and fast monitoring sensor for a specific analyte, for this purpose, nanoparticles ͑NPs͒ are promising tools because they could facilitate electron-transfer reactions, and this could be coupled with ease of miniaturization of sensing devices to nanoscale dimensions. Nanoparticles are suitable for important applications in chemical/biochemical sensing because of their high surface-to-volume ratio and highly effective catalytic properties. 1-10

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Pretreatment of polymer surfaces—the crucial step prior to metal deposition

Cited by 28 publications

References 6 publications

Kinetic Study of Wet Chemical Treatments on the Surface Roughness of Epoxy Polymer Layers for Buildup Layers

Kinetic Study of Wet Chemical Treatments on the Surface Roughness of Epoxy Polymer Layers for Buildup Layers

Oxidation and photo-induced oxidation of glucose at a polyaniline film modified by copper particles

Electrochemical Analysis of H[sub 2]O[sub 2] and Nitrite Using Copper Nanoparticles/Poly(o-phenylenediamine) Film Modified Glassy Carbon Electrode

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