Pressure-sensitive adhesive composites with a hydrophobic form of graphene oxide for enhanced thermal conductivity

Vu, Minh Canh; Park, Gyu-Dae; Bae, Yong-Han; Yu, Min Ji; An, Tae Kyu; Lee, Sung-Goo; Kim, Sung‐Ryong

doi:10.1007/s13233-016-4151-0

Cited by 13 publications

(5 citation statements)

References 42 publications

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“…Recently, polymer‐based nanocomposites, possessing several excellent properties including economy, facile‐process, thermal, and chemical resistance, have been receiving a lot of attention for employing as thermal dissipating materials (TDMs) 4–6 . Conventional TDMs are mainly comprised of polymers matrix and various highly thermoconductive additives including carbon‐based nanomaterials, metal, and ceramic nanoparticles 7–10 . Generally, high thermal conductivity can be attained at a large amount of thermoconductive additives in the polymer matrix.…”

Section: Introductionmentioning

confidence: 99%

In situ sintered silver decorated 3D structure of cellulose scaffold for highly thermoconductive electromagnetic interference shielding epoxy nanocomposites

Tran

Nguyen

et al. 2021

J of Applied Polymer Sci

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This study presents a 3-dimensional (3D) network structure of cellulose scaffold (CS), which was in situ decorated with silver nanoparticles (AgNPs). The scaffold was then infiltrated with epoxy matrix and cured at elevated temperature to sinter the AgNPs; finally, highly thermoconductive epoxy composites (Ag@CS/epoxy) was obtained. The resultant Ag@CS20/epoxy composite reached a thermal conductivity of 2.52 WÁm À1 ÁK À1 at 2.2 vol% of filler loading, which shows an enhancement of over 11-folds in the thermal conductivity compared to the neat epoxy. The superb electrical conductivity value of over 53,691 SÁm À1 of the Ag@CS20/epoxy was achieved, which led to exceptional EMI SE values of 69.1 dB. Furthermore, surface temperatures during heating and cooling were also investigated to demonstrate the superior heat dissipating capacity of the Ag@CS/epoxy composite, which can be potentially put an application as thermal dissipating material in the next generation of electronics.

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Section: Introductionmentioning

confidence: 99%

In situ sintered silver decorated 3D structure of cellulose scaffold for highly thermoconductive electromagnetic interference shielding epoxy nanocomposites

Tran

Nguyen

et al. 2021

J of Applied Polymer Sci

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“…However, the chemical treatment of the conductive nanofillers would form more defects leading to the deterioration of their exceptional inherent properties. 21 Recently, cross-linking approaches such as ionic crosslinking have shown promise in enhancing the mechanical strength, flexibility, and thermal conductivity of nanomaterialfilled composites. 22 Ionic cross-linking involves the coordination of complex formation between oppositely charged polymeric chains and multivalent metal cations, which serves to improve the interaction between the matrix and nanofillers.…”

Section: Introductionmentioning

confidence: 99%

“…As a result, the mechanical strength of the hBN/CNF showed a 63.2% improvement compared with that of the untreated boron nitride/CNF films. However, the chemical treatment of the conductive nanofillers would form more defects leading to the deterioration of their exceptional inherent properties …”

Section: Introductionmentioning

confidence: 99%

Thermoconductive Graphene Fluoride Cross-Linked Aramid Nanofiber Composite Films with Enhanced Mechanical Flexibility and Flammable Retardancy for Thermal Management in Wearable Electronics

Nguyen,

Tran,

Mai

et al. 2023

ACS Appl. Nano Mater.

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Flexible electronics require thermally conductive materials with excellent mechanical flexibility to dissipate heat and ensure optimal performance. This work reports the development of metallic ionic cross-linked thermally conductive and mechanically flexible films composed of aramid nanofibers (ANFs) and exfoliated graphene fluoride (EGF) nanosheets. EGF was prepared by liquid exfoliation of fluorinated graphite and incorporated into ANF films fabricated by vacuum filtration. Metallic ion (Al 3+ ) treatment was used to improve interfacial interactions between the EGF fillers and ANF matrix. The EGF-reinforced ANF composite films displayed excellent in-plane thermal conductivity up to 19.48 W/mK for the sample with 50 wt % EGF, owing to the high intrinsic thermal conductivity of EGFs and their preferential alignment along the in-plane direction. The composite films also exhibited outstanding mechanical flexibility and durability, with tensile strength >150 MPa even at 50 wt % EGF content, enabled by efficient stress transfer across the EGF−ANF interface. Thermal conductivity was thermally stable up to 200 °C. The unique combination of high in-plane thermal conductivity, mechanical flexibility, and thermal stability illustrates the potential of ANF/EGF films for effective thermal management in flexible electronics.

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“…Among these, graphene stands out due to its exceptional thermal conductivity (5300 W/mK) and mechanical properties [7]. For instance, Vu et al reported that polymer composites with a 5 wt% fraction of functionalized graphene filler achieved a high thermal conductivity of0.6 W/mK [8]. Additionally, graphene nanoplatelet-based aramid nanofiber films exhibited a remarkable thermal conductivity of 68.2 W/mK [9].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of fluorinated graphene based aramid nanofibers films with excellent thermal conductivity and mechanical properties

Vu,

Tran,

Tao

et al. 2023

UD-JST

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The rapid advancement of technology has spurred the development of a wide range of sophisticated electronic devices leading to an increasing demand for the utilization of thermoconductive materials to address thermal management. However, most of the available thermoconductive materials possess inadequate mechanical properties and low resistance to temperatures. To address this limitation, this study focuses on fabricating the thermoconductive films using aramid nanofiber (ANF) as strengthening components and fluorinated graphene (FG) as a thermoconductive filler. The films are prepared through the simple vacuum filtration method. The obtained FG/ANF film with 40 wt% of FG reached the in-plane thermal conductivity of 9 W/mK. Additionally, the FG40/ANF film exhibits excellent mechanical properties, including a tensile strength exceeding 110 MPa and toughness greater than 7.2 MJ/m³. Given these remarkable characteristics, the FG/ANF film holds significant promise as a material for dissipating heat in electronic devices, particularly in applications that demand high mechanical performance and temperature stability.

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Pressure-sensitive adhesive composites with a hydrophobic form of graphene oxide for enhanced thermal conductivity

Cited by 13 publications

References 42 publications

In situ sintered silver decorated 3D structure of cellulose scaffold for highly thermoconductive electromagnetic interference shielding epoxy nanocomposites

In situ sintered silver decorated 3D structure of cellulose scaffold for highly thermoconductive electromagnetic interference shielding epoxy nanocomposites

Thermoconductive Graphene Fluoride Cross-Linked Aramid Nanofiber Composite Films with Enhanced Mechanical Flexibility and Flammable Retardancy for Thermal Management in Wearable Electronics

Fabrication of fluorinated graphene based aramid nanofibers films with excellent thermal conductivity and mechanical properties

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