Present problems of power module packaging technology

Shammas, N.Y.A.

doi:10.1016/s0026-2714(03)00019-2

Cited by 89 publications

(38 citation statements)

References 18 publications

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“…Its geometrical sizes were found (the diameter of 12.7 mm, the height of 4 mm) in order to calculate the resulting density, which was found to be equal to 7.48 g/sm 3 . Figure 3 shows the SEM-image of the sintered Cu-Mo ceramics sample.…”

Section: Resultsmentioning

confidence: 99%

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Obtaining molybdenum-copper composite for effective thermal control in electronic systems

2017

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Abstract. In the article, the molybdenum and copper powders, obtained by electric explosion of wires and plasma-dynamic method, respectively, were sintered by spark plasma sintering technology, in order to obtain bulk sample based on them. X-ray diffractometry and scanning electron microscopy were carried out to study the chemical composition and structure of the resulting ceramics. XRD analysis showed that the product consisted of the following main phases such as molybdenum of a cubic crystalline structure (space group Im3m, No. 229) and copper of cubic system (space group Fm-3m, No. 225). The results of scanning electron microscopy indicated that the sintered sample had heterogeneous structure with the presence of small pores. Nonetheless, the mechanical properties such as hardness (Vickers hardness of 292 HV) and thermal conductivity (140.53 W / m · C) are good enough that allows considering the proposed synthesizing methods as well as sintering technology as promising for creating the Cu-Mo ceramics with high-mechanical properties.

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Section: Resultsmentioning

confidence: 99%

“…Electronic components are usually installed on substrates or plates, which act as the heat removal elements and provide an effective thermal control [3][4][5]. However, not all materials have suitable properties for reliable heat dissipation.…”

Section: Introductionmentioning

confidence: 99%

Obtaining molybdenum-copper composite for effective thermal control in electronic systems

2017

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“…In order to simplify the thermal model, critical nodes in the thermal system should be identified. The main catastrophic failures in the IGBT modules occur due to electro-thermal stress in the bond-wires that lead to lift-off and aging of the solders that lead to cracks [21]. Therefore, the measurement nodes are defined in the surface of the chip, where the wires are bonded and solder layers.…”

Section: The Proposed Three-dimensional Thermal Networkmentioning

confidence: 99%

A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules

Bahman

Blaabjerg

2018

IEEE Trans. Power Electron.

196

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Abstract-Detailed thermal dynamics of high power IGBT modules are important information for the reliability analysis and thermal design of power electronic systems. However, the existing thermal models have their limits to correctly predict these complicated thermal behavior in the IGBTs: The typically used thermal model based on one-dimensional RC lumps have limits to provide temperature distributions inside the device, moreover some variable factors in the real-field applications like the cooling and heating conditions of the converter cannot be adapted. On the other hand, the more advanced threedimensional thermal models based on Finite Element Method (FEM) need massive computations, which make the long-term thermal dynamics difficult to calculate. In this paper, a new lumped three-dimensional thermal model is proposed, which can be easily characterized from FEM simulations and can acquire the critical thermal distribution under long-term studies. Meanwhile the boundary conditions for the thermal analysis are modeled and included, which can be adapted to different realfield applications of power electronic converters. Finally, the accuracy of the proposed thermal model is verified by FEM simulations and experimental results show a good agreement.

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“…When internal defects arise in electrical equipment, a rise of inside and surface temperature will happen, therefore temperature measurement technology is widely used in condition evaluation of electrical equipment, including power transformers [1], circuit breakers [2] and power electronics [3][4]. As one of the key components in power electronics systems, IGBT modules are exposed to wear-out failures, including bond wire lift off and solder fatigue [5].It is believed that the failure propagation will change the electrical and thermal behaviors of IGBTs. Information regarding its temperatures is important to ensure a reliable design of converter [6][7].…”

Section: Introductionmentioning

confidence: 99%

A Temperature Gradient-Based Potential Defects Identification Method for IGBT Module

Gao

Yang

Chen

et al. 2017

IEEE Trans. Power Electron.

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Present problems of power module packaging technology

Cited by 89 publications

References 18 publications

Obtaining molybdenum-copper composite for effective thermal control in electronic systems

Obtaining molybdenum-copper composite for effective thermal control in electronic systems

A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules

A Temperature Gradient-Based Potential Defects Identification Method for IGBT Module

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