Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging

Wang, Jianqiang; Duan, Fangcheng; Wang, Jintao; Zhang, Weiwei; Zhang, Luobin; Li, Mingyu; Chen, Hang; Chen, Hongtao

doi:10.1007/s10854-023-10123-4

Cited by 2 publications

(1 citation statement)

References 18 publications

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“…Also, its porous structure facilitates the wetting and spreading of the liquid phase for forming a uniform bonding. Thus, an interlayer of P-Cu introduced in TLPB can shorten bonding time and enhance the bonding properties (Liu et al , 2020b; Wang et al , 2023b).…”

Section: Introductionmentioning

confidence: 99%

Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

Xiong,

He,

et al. 2023

SSMT

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Purpose This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB). Design/methodology/approach TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs). Findings The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal. Originality/value Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

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Section: Introductionmentioning

confidence: 99%