Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics

Wang, Fengyi; Lv, Ziwen; Zhong, Xiangxiang; Wang, Jianqiang; Li, Fuquan; Chen, Hongtao; Li, Mingyu

doi:10.1016/j.jtice.2023.105192

Journal of the Taiwan Institute of Chemical Engineers

2023

DOI: 10.1016/j.jtice.2023.105192

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Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics

Fengyi Wang,

Ziwen Lv,

Xiangxiang Zhong

et al.

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Cited by 3 publications

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Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics

Cited by 3 publications

References 34 publications

Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model

Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model

Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints

Cu array fabrication: An environmentally sustainable approach through bicontinuous microemulsion differential electrodeposition for advanced power device packaging

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