2023
DOI: 10.1007/s12598-022-02195-8
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Preparation of quasi-isotropic thermal conductive composites by interconnecting spherical alumina and 2D boron nitride flakes

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Cited by 21 publications
(9 citation statements)
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“…Thermal management materials are widely applied in the fields of electronic devices, optoelectronic devices, and thermoelectric devices, where they control the dispersion, storage, and conversion of heat within a system, for example, thermal switches, heat sinks, , and other devices. Exploring the thermal transport properties of thermal management materials is critical for both material application and device design. In particular, the extremely low lattice thermal conductivity (κ l ) of materials has garnered significant attention in the research community. , After decades of efforts, the κ l of materials are controlled to 0.5–2 W/mK at room temperature, such as bulk Au 2 S exhibits κ l of 1.99 W/mK, the κ l of penta-Sb 2 C is 0.88 W/mK, the κ l of two-dimensional tellurene is merely 0.61 W/mK .…”
Section: Introductionmentioning
confidence: 99%
“…Thermal management materials are widely applied in the fields of electronic devices, optoelectronic devices, and thermoelectric devices, where they control the dispersion, storage, and conversion of heat within a system, for example, thermal switches, heat sinks, , and other devices. Exploring the thermal transport properties of thermal management materials is critical for both material application and device design. In particular, the extremely low lattice thermal conductivity (κ l ) of materials has garnered significant attention in the research community. , After decades of efforts, the κ l of materials are controlled to 0.5–2 W/mK at room temperature, such as bulk Au 2 S exhibits κ l of 1.99 W/mK, the κ l of penta-Sb 2 C is 0.88 W/mK, the κ l of two-dimensional tellurene is merely 0.61 W/mK .…”
Section: Introductionmentioning
confidence: 99%
“…Nowadays, with the rapid advancement of modern microelectronics technology, electronic products and devices are gradually moving towards miniaturization and high integration. [1][2][3] While this brings forth enhanced functionality, it also results in increasing power consumption and heat generation. [4][5][6] Due to the detrimental effects of high working temperatures on the stability and reliability of electronic devices, heat dissipation has become one of the signicant bottlenecks impeding the rapid progress of electronic technology.…”
Section: Introductionmentioning
confidence: 99%
“…Unlike two-dimensional lamellar nanomaterials, spherical particles as isotropic fillers are characterized by low viscosity and good particle mobility. Considering the cost and feasibility, spherical alumina is employed as the second thermally conductive filler with BN to construct a multidimensional hybrid filler system with both high thermal conductivity and electrical insulation properties . Here, PDMS containing alumina is vacuum-impregnated into a 3D foam skeleton as a secondary thermal conductive network, thus making full use of the skeleton pores.…”
Section: Introductionmentioning
confidence: 99%
“…Considering the cost and feasibility, spherical alumina is employed as the second thermally conductive filler with BN to construct a multidimensional hybrid filler system with both high thermal conductivity and electrical insulation properties. 20 Here, PDMS containing alumina is vacuum-impregnated into a 3D foam skeleton as a secondary thermal conductive network, thus making full use of the skeleton pores. In this way, the hybrid filler synergistic effect is successfully achieved to build sufficient multilevel thermal conductive pathways.…”
Section: Introductionmentioning
confidence: 99%