Boosting the in-plane thermal conductivity of nanofibrillated cellulose films: alignment engineering of cross-linked AlN whiskers

Abstract

With the rapid advancement of foldable electronic devices, it has garnered significant attention towards ultra-light, flexible and anisotropic composite films with high in-plane thermal conductivity. Aluminum nitride (AlN), as a...

Enhancing the Thermal Conductivity of Epoxy Composites via Constructing Oriented ZnO Nanowire-Decorated Carbon Fibers Networks

“…In the field of heat dispassion, thermal interface materials (TIMs) play an important role, generally used between chips and heat sinks to fill with the microscopic voids and holes, thus reducing the contact thermal resistance, establishing effective pathways for heat transfer, and improving the heat dissipation ability of electronic devices. Therefore, the development of high-performance TIMs is of great scientific significance and commercial value in response to the rapidly growing demand for heat dissipation [4][5][6][7].…”

In situ construction of vertically aligned AlN skeletons for enhancing the thermal conductivity of stearic acid-based phase-change composites

“…and ceramics ( e.g. AlN, 15–18 Al 2 O 3 , 19 Si 3 N 4 , 20,21 BN, 22,23 etc. ) are the most common thermally conductive fillers.…”