2007
DOI: 10.1016/j.surfcoat.2007.04.100
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Preparation of nanocrystalline cubic silicon carbide thin films by hot-wire CVD at various filament-to-substrate distances

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Cited by 25 publications
(9 citation statements)
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“…Since the decomposition of the SiH 4 and CH 4 are at different filament temperatures, the SiH 4 starts to decompose at 1027 °C and the decomposition rate increases at temperatures above 1427 °C [18]. However, moderate decomposition of CH 4 only occurs at 1750 °C and above [19, 20]. Therefore, HWCVD utilizes the growth of Si-based nanostructures with different morphologies and compositions by tuning the decomposition rate of the source gases by varying the hot filament temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Since the decomposition of the SiH 4 and CH 4 are at different filament temperatures, the SiH 4 starts to decompose at 1027 °C and the decomposition rate increases at temperatures above 1427 °C [18]. However, moderate decomposition of CH 4 only occurs at 1750 °C and above [19, 20]. Therefore, HWCVD utilizes the growth of Si-based nanostructures with different morphologies and compositions by tuning the decomposition rate of the source gases by varying the hot filament temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Using HWCVD, high-quality amorphous and microcrystalline silicon materials (a-Si:H and μc-Si:H) and related high-performance solar cells and thin film transistors have been fabricated [2][3][4][5][6]. Besides silicon, HWCVD technique also shows its superiority in depositing stoichiometric microcrystalline silicon carbide (μc-SiC:H) material with mainly cubic SiC polytype at low substrate temperatures [7][8][9][10][11]. Such wide band-gap μc-SiC:H material is an outstanding window layer for solar cells, such as silicon thin film solar cells [12,13] and silicon heterojunction solar cells [14][15][16][17].…”
Section: Introductionmentioning
confidence: 99%
“…The PE-CVD technique has an integration advantage in the device fabrication with the current technologies employed in semiconductor industries but this technique has the problem of ion damage on the growing surface and interfaces because of use of high power density, low deposition rate due to use of high hydrogen dilution and low carbon incorporation efficiency. In recent years, hot wire chemical vapor deposition (HW-CVD) technique has emerged as a promising technique to deposit such films at relatively low substrate temperature [18][19][20][21][22]. The two major advantages of employing HW-CVD method for the synthesis of SiC coatings are the absence of the deleterious electrons and ions and surface charges which avoid of powder formation and second is high dissociation rate of source gases which leads to higher deposition rate.…”
Section: Introductionmentioning
confidence: 99%