Preparation of micron-sized flake copper powder for base-metal-electrode multi-layer ceramic capacitor

Wu, Songping; Gao, Ruohang; Xu, Liguo

doi:10.1016/j.jmatprotec.2008.03.010

Cited by 17 publications

(5 citation statements)

References 12 publications

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“…There was a distinct exothermal peak attributed to quick oxidation of copper at 260.2 °C in DTA curve. The phenomenons are agree with the curve of flake copper powders did by Wu et al . As known, if Cu is oxidized to Cu 2 O and CuO, the weight gain is 11.24% and 25% respectively.…”

Section: Resultssupporting

confidence: 91%

Epoxy‐based adhesives filled with flakes ag‐coated copper as conductive fillers

Zhao

Zhang

2015

Polymer Composites

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The flake core–shell Cu‐Ag powders are prepared and characterized. Isotropic conductive adhesives (ICAs) filled with flake silver‐coated copper was prepared by using epoxide resin as matrix and tetraethylenepentamine as curing agent. The flake silver‐coated copper was characterized by scanning electron microscopy, X‐ray diffraction, energy dispersive X‐ray spectroscopy, and TG‐DTA. The results show Ag content in the surface of coated copper is up to 96.32%. Oxidation resistance of flake Cu‐Ag powders with high surface Ag content is improved greatly investigated by TG‐DTA. And bulk resistivity and shear strength of ICAs are measured. It was found that the percolation threshold of ICAs filled with flake Cu‐Ag powders is as low as 40 wt%. The ICAs have good overall performances. And the main influence factor on electric resistivity was analyzed. POLYM. COMPOS., 38:846–851, 2017. © 2015 Society of Plastics Engineers

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Section: Resultssupporting

confidence: 91%

Epoxy‐based adhesives filled with flakes ag‐coated copper as conductive fillers

Zhao

Zhang

2015

Polymer Composites

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“…Thus, morphologies as shown in Figure 3c could be observed. Micron-sized solid particles are favored for applications including conductive thick film pastes used for printing conductive lines and interference packaging (Huang and Sheen 1997;Wu et al 2009). Based on our experimental results, high temperature (1000 C) and long residence time (4.5 s) promotes the formation of micron-sized solid Cu-Sn particles, a potential condition for the further real application.…”

Section: Diffusion Of Sn To Form a Solid Solutionmentioning

confidence: 75%

“…However, reported methods for Cu-Sn material synthesis focus on producing nano-sized particles (Cao et al 2014;Jo et al 2011) and thin films (Polat et al 2014;Kumar et al 2011). Therefore, it is desirable to develop a continuous and potentially scalable process to fabricate micron-sized Cu-Sn powders, because they are favored for applications such as conductive pastes and interference packaging (Wu et al 2009;Deshpande et al 2005).…”

Section: Introductionmentioning

confidence: 99%

Cu-Sn binary metal particle generation by spray pyrolysis

Liang

Felix

Glicksman

et al. 2016

Aerosol Science and Technology

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Cu-Sn binary particles were generated via spray pyrolysis from metal salt precursors with ethylene glycol as the co-solvent and reducing agent. The morphology, crystallinity, and elemental distribution of particles were tunable by changing the reaction temperature, residence time, and quench gas flow rate. Hollow porous particles were fabricated with a higher Sn concentration on the particle surface when the furnace set point was 500 C, while solid particles with a lower surface Sn concentration were generated when the furnace set point was 1000 C. Particles with spherical morphologies were obtained at long residence time conditions (4.5 s). Cu-Sn binary particles with irregular structures (e.g., pores on the particle surface, fragmented spherical particles, and lamellar fragments) were formed at short residence time conditions (0.92 s). A possible spray pyrolysis mechanism was proposed that incorporates chemical reaction steps and structural progression. By this mechanism, the metal salts are believed to sequentially undergo hydrolysis to metal hydroxides, decomposition to metal oxides, reduction to metals, and finally diffusion of Sn into the Cu matrix to generate the Cu-Sn solid solution.

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“…Then 1.0 g of CNTs and 1.5 g of sodium dodecyl sulfate were dispersed into 200 ml of deionized water, and sonicated for 2 h to get a black CNT aqueous suspension [23]. Ball milling was used to change the as-received near-spherical Cu powders (purity more than 99.7%, particle sizes smaller than 38 µm) into Cu flakes; details of the technique can be found in [24,25]. Different from the previous methods, an imidazoline derivative (IMD) aqueous solution was added as corrosion inhibitor and surfactant.…”

Section: Methodsmentioning

confidence: 99%

Two-dimensional distribution of carbon nanotubes in copper flake powders

Tan

Li²,

Fan³

et al. 2011

Nanotechnology

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We report an approach of flake powder metallurgy to the uniform, two-dimensional (2D) distribution of carbon nanotubes (CNTs) in Cu flake powders. It consists of the preparation of Cu flakes by ball milling in an imidazoline derivative (IMD) aqueous solution, surface modification of Cu flakes with polyvinyl alcohol (PVA) hydrosol and adsorption of CNTs from a CNT aqueous suspension. During ball milling, a hydrophobic monolayer of IMD is adsorbed on the surface of the Cu flakes, on top of which a hydrophilic PVA film is adsorbed subsequently. This PVA film could further interact with the carboxyl-group functionalized CNTs and act to lock the CNTs onto the surfaces of the Cu flakes. The CNT volume fraction is controlled easily by adjusting the concentration/volume of CNT aqueous suspension and Cu flake thickness. The as-prepared CNT/Cu composite flakes will serve as suitable building blocks for the self-assembly of CNT/Cu laminated composites that enable the full potential of 2D distributed CNTs to achieve high thermal conductivity.

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Preparation of micron-sized flake copper powder for base-metal-electrode multi-layer ceramic capacitor

Cited by 17 publications

References 12 publications

Epoxy‐based adhesives filled with flakes ag‐coated copper as conductive fillers

Epoxy‐based adhesives filled with flakes ag‐coated copper as conductive fillers

Cu-Sn binary metal particle generation by spray pyrolysis

Two-dimensional distribution of carbon nanotubes in copper flake powders

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