Preparation of Electron Microscope Disk Specimens by Ultrasonic Impact Grinding

Rennhack, E. H.

doi:10.1063/1.1686215

Cited by 2 publications

(3 citation statements)

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“…The pattern dimensions are limited by one's ability to machine the master pattern in the metal for the tool head, and the size of the particles in the slurry. Using the same machine as used in this work, Rennhack [1] reported a cutting tolerance of the order of two times the average abrasive particle diameter. The slurry can be composed of any of the materials and powders used in classical lapping and polishing; however, the authors prefer silicon carbide and boron carbide powder.…”

Section: Principle Of Ultrasonic Grindingmentioning

confidence: 91%

“…Ultrasonic impact grinding (UIG) is an old but virtually unknown technique in the MEMS community which can be used to fabricate small, even ornate patterns in brittle materials such as silicon, glass and ceramics. Although suited primarily for brittle materials, UIG has been used to prepare metallic foils and metal composites [1,2]. This laboratory has used this technique for decades to fabricate such configurations as small complex Hall sensors in silicon [3].…”

Section: Introductionmentioning

confidence: 99%

“…The basic machine used in this work was a Raytheon Model 2-334 Ultrasonic Impact Grinder (no longer marketed) head assembly, coupled with a general purpose ultrasonic generator. Much earlier work by Rennhack [1] in preparation of samples for electron microscope analysis and by Chen et al [4] for preparation of geodesic lenses, used the same machine.…”

Section: Introductionmentioning

confidence: 99%

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Micromachining using ultrasonic impact grinding

Medis¹,

Henderson²

2005

J. Micromech. Microeng.

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Although largely unknown in the MEMS community, micromachining using ultrasonic impact grinding (UIG) is a fascinating yet easy fabrication scheme to achieve virtually any shape, such as a shallow or deep reservoir, a channel, a via, etc, in silicon, glass and other commonly used ceramic and semiconductor materials in the MEMS field. Because of the patterning and masking issues, etching even shallow channels or vias in a pre-processed silicon/glass/ceramic substrate is somewhat difficult, if not impossible. However, by using UIG one can achieve such structures, up to millimeters in depth in virtually no time. Furthermore, in silicon substrates, the orientation or any other physical dimension of the feature will no longer be constrained as in anisotropic etching by the crystallographic planes and directions; and in amorphous glass or ceramic substrates, features with vertical walls can be achieved, otherwise usually accomplished only by expensive laser ablation. Thus, the authors believe that this UIG process could open up many avenues to easily and quickly achieve the larger MEMS structures as well as packaging for both prototype and for production in silicon, glass and ceramic.

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Section: Principle Of Ultrasonic Grindingmentioning

confidence: 91%

Section: Introductionmentioning

confidence: 99%