Preparation of a novel bi-layer modified alumina-based hybrid material and its effect on the thermal conductivity enhancement of polymer composites

One-pot fabrication of an anisotropic thermally conductive boron nitride/polyvinyl alcohol composite film based on salting-out effect

“…The dielectric constant values and dielectric loss were collected by the broadband dielectric spectrometer (Novocontrol concept) at the frequency range from 10 −1 to 10 7 Hz. 26 The in-plane and cross-plane thermal conductivity of samples were recorded by a thermal conductivity tester (LFA-467 Nano-flash, NETZSCH). The thermal images were collected by an infrared imager (Ti400, Fluke).…”

Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

“…With the rapid development of microelectronic techniques, chips are becoming smaller and more integrated, and computing speed is becoming faster. − Consequently, a significant amount of heat generates in chips with a small volume, causing the reduction of operating stability and service life. , Heat dissipation has become a critical issue for electronic packing materials. , This problem is usually addressed by the bonding of thermal interface materials (TIMs) between the chips and the heat spreader to transfer the heat generated from the operation of chips, thereby ensuring proper operation of chips. , Polymer materials have been widely applied in the area of TIMs due to their good mechanical properties, electric insulation, convenient durability, and easy processability. − However, the thermal conductivities of polymers are not good (about 0.2–0.5 W m K –1 ). To improve the heat conduction performance, thermally conductive fillers are incorporated into the polymer matrix, including BN, AlN, Al 2 O 3 , CNT, and GNP, in which the thermal resistance between fillers is considerable that decreasing the heat conduction efficiency seriously.…”

“…Zeng and co-workers enhanced the thermal conductivity of polymer composites through silver nanoparticle modification on alumina microspheres . Zhao et al prepared high thermal conductive composites using the modified thermally conductive fillers that were fabricated through a joint decoration of Ag nanoparticles and Cu nanoparticles. , The metal nanoparticles can function as bridges to increase the contact area between thermally conductive fillers, thereby reducing thermal resistance between fillers. Kim and co-workers used the oil/water biphasic solution process to synthesize silicon oxycarbonitride-coated graphene oxide to decrease the electrical conductivity of graphene oxide and enhance the thermal conductivity of epoxy composites .…”

“…1−4 Consequently, a significant amount of heat generates in chips with a small volume, causing the reduction of operating stability and service life. 5,6 Heat dissipation has become a critical issue for electronic packing materials. 7,8 This problem is usually addressed by the bonding of thermal interface materials (TIMs) between the chips and the heat spreader to transfer the heat generated from the operation of chips, thereby ensuring proper operation of chips.…”

Constructing “sesame‐biscuit” structured hybrids with SiC and Ag particles for enhancing thermal conductivity and dielectric constant of elastomer composites

“…18 In recent years, the production of hybrid fillers by combining ceramic fillers and metal particles has become a reliable way to obtain polymeric composites with high λ values and excellent insulation at a low filler loading. 14,19 Zhao et al 20 Cu-Ag particles reached a value of 1.4650 W/(mK), which was 651% higher than pure PDMS (0.1950 W/(mK)). Additionally, the AC conductivity of the PDMS composites was less than 10 À10 S/cm, showing good insulation.…”