Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties

Abstract

New composites with improved thermal stability, mechanical and dielectric properties were developed, which consist of 2,2'-diallylbisphenol A (DBA)/4,4'-bismaleimidodiphenylmethane (BDM) resin and a new kind of organic/inorganic mesoporous silica (MPSA). Typical properties (curing behavior and mechanism, thermal stability, mechanical and dielectric properties) of the composites were systematically investigated, and their origins were discussed. Results show that MPSA/DBA/BDM composites have similar curing temperature as DBA/BDM resin does; however, they have different curing mechanisms, and thus different crosslinked networks. The content of MPSA has close relation with the integrated performance of cured composites. Compared with cured DBA/BDM resin, composites with suitable content of MPSA show obviously improved flexural strength and modulus as well as impact strength; in addition, all composites not only have lower dielectric constant and similar frequency dependence, more interestingly, they also exhibit better stability of frequency on dielectric loss. For thermal stability, the addition of MPSA to DBA/BDM resin significantly decreases the coefficient of thermal expansion, and improves the char yield at high temperature with a slightly reduced glass transition temperature. All these differences in macro-properties are attributed to the different crosslinked networks between MPSA/DBA/BDM composites and DBA/BDM resin

A novel hybrid functional nanoparticle and its effects on the dielectric, mechanical, and thermal properties of cyanate ester

“…However, because the pore size of incorporated MPS is larger than that of polymer molecules, the penetration of polymer into pores of MPS, which benefits interface interaction of composites, reduces the air space and leads to weak effects on the decrease of κ. Therefore, several blocking materials should be attached to the entrance side of the mesopores to prevent the entry of the polymer .…”

Thermal and frictional properties of mesoporous silica SBA‐15/phenolic resin nanocomposites

“…Mesoporous silica have advantages over conventional nanomaterials due to their ordered pore structure and tunable pore sizes, which are usually used as the reinforcer of polymer matrix, while the polymer molecular chains embedded in pore channels of mesoporous silica, it would be enhanced the interfacial action among the components, and thus improve the mechanical and thermal properties of polymers composites [10,16,17,[21][22][23][26][27][28], and even produce a low dielectric property [15,17,[21][22][23]28] and low thermal expansion property [18,19,24,25]. According to the literature, the enhancement of the performance of mesoporous silica-embedded polymer composite is mainly attributed to the formation of novel inorganic-organic hybrid material, in which polymer molecular chains intertwined on the surface of mesoporous silica or penetrated into the pore channels.…”

“…In situ polymerization is more effective for dispersing mesoporous silica in a polymer matrix. Meanwhile, some specific resins have been used as polymer matrix for friction material, including epoxy resins [15,16,[18][19][20][21][22]24], polyolefin resins [10,26,27], and other polymers [17,23,25,28]. It is necessary for mesoporous silica to modify their surface to improve interfacial compatibility between the polymer matrix and mesoporous silica.…”

Synthesis and characterization of multifunctional propenyl-endcapped aromatic co-monomers and their use as bismaleimide modifiers

“…Nevertheless, the thermal stabilities as well as the dielectric properties need to be further improved in order to satisfy the strict requirements set by various applications and future innovations. [9] In addition to this, one critical requirement for current technologies involving the production of advanced composite materials to lower the cure temperature of the resin systems for cost reduction and improvement of the overall production process.…”