Characteristics of Ti/Au and Ti 2 N/Ti/Au ohmic contacts on n-type GaN films were investigated in detail, before and after the thermal annealing. As-deposited GaN/Ti/Au contacts showed ohmic properties with low resistivity, ∼3.7 × 10 −5 cm 2 , but showed rectifying properties after heat treated at temperatures higher than 500 • C. Formation of new phases at the GaN/Ti interfaces, such as Ga 3 Ti 5 , Ga 4 Ti 5 , and TiN, was observed in the case of 700 • C annealed samples, which were proposed to be responsible for the high-temperature degradation. As-deposited GaN/Ti 2 N/Ti/Au contact was also ohmic, with ∼8.2 × 10 −5 cm 2 resistivity. Heat treated samples showed lower resistivity, ∼2.2 × 10 −5 cm 2 for the 700 • C and ∼6.2 × 10 −5 cm 2 for the 800 • C, suggesting that the Ti 2 N buffer layer prevented or minimized interfacial reaction between GaN and Ti, resulting in much better thermal stability.