Preparation and characterization of novel polyimide films containing amide groups

Luo, Longbo; Pang, Y.; Jiang, Xue; Wang, Xu; Zhang, Peng; Chen, Yi; Peng, Chaorong; Li, Xiangyang

doi:10.1007/s10965-011-9783-3

Cited by 33 publications

(11 citation statements)

References 18 publications

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“…High-performance aromatic polyimide (PI) fibers have been considered as one of the most promising engineering materials due to their excellent mechanical properties, thermal stability, and chemical resistance along with dielectric performance [1][2][3]. Currently, two major techniques including one-step method and two-step method are mainly used to prepare PI fibers [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Structures and properties of polyimide fibers containing ether units

et al. 2015

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Copolyimide (co-PI) fibers containing 4,4 0 -oxydiphthalic anhydride (ODPA) moiety into the 3,3 0 ,4,4 0 -biphenyltetracarboxylic dianhydride (BPDA)/p-phenylenediamine backbone were prepared via a two-step wet-spinning method. The processability and mechanical properties were improved significantly after the incorporation of ODPA, and the fibers exhibited an optimum tensile strength of 10.94 cN dtex -1 and modulus of 470.52 cN dtex -1 with elongation of 2.75 % at a BPDA/ODPA molar ratio of 7/3. Two-dimensional wide angle X-ray diffraction indicated that highly oriented structures and ordered molecular packing regions were formed in the fibers. Two-dimensional small angle X-ray scattering revealed that the incorporation of ODPA resulted in the reduction in radius, length, misorientation, and internal surface roughness of the microvoids in the fibers simultaneously, which was supposed to be mainly dominated for the drastically improved mechanical properties of PI fibers. Moreover, the co-PI fibers exhibited excellent thermal and thermal-oxidative stability, and the 5 % weight loss temperature was above 572 and 535°C under nitrogen and air, respectively.

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Section: Introductionmentioning

confidence: 99%

Structures and properties of polyimide fibers containing ether units

et al. 2015

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“…where U 0 and U X are the backgrounds of the reference filaments and experimental filaments, and I 0 and I X are the integral intensities of diffraction lines of the reference filaments and experimental filaments, respectively. 27 Curve-fitting deconvolution of the WAXD profiles was analyzed using Origin 9.0 software to separate crystalline and amorphous contributions. The crystallinity (X c ) can be confirmed based on equation (4)…”

Section: Characterizationsmentioning

confidence: 99%

Structure, property and knittability of polyimide filaments with various strength and modulus

Lin

et al. 2018

Textile Research Journal

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This paper presents an experimental investigation on the knittability of various polyimide (PI) filaments, namely PI-H (high strength and modulus), PI-M (moderate strength and modulus) and PI-L (low strength and modulus) filaments. The tensile strength of the PI-H, PI-M and PI-L filaments is 3.41, 1.65 and 0.88 GPa, and the Young’s modulus is 92.94, 40.71 and 9.43 GPa, respectively. The chemical compositions and structures of various PI filaments were characterized to explain the mechanical performance differences. The results show that the imidization degree, structural crystallinity and orientation have significant effects on the mechanical behaviors of PI monofilaments. The filament forces during the knitting process are simplified into straight tensile, loop tensile and abrasion actions, which have been tested and analyzed on PI monofilaments. A home-made simulative knittability analyzer was designed to test the knittability of the PI filaments. A hand flat knitting machine was used to verify the validity of the simulating methods and the constructed knittability analyzer. The PI-H, PI-M and PI-L filaments have poor, moderate and excellent knittability, respectively. The results also demonstrate that the simulating methods and the constructed simulative knittability analyzer are reasonable and efficient to evaluate the knittability of PI filaments.

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“…As one of the most promising high-performance materials (HPM), the PI is known for its excellent mechanical and electrical properties, outstanding thermal stability, superior chemical resistance, and high hardness [1,2,3,4]. Owing to those distinctive properties, PI has been widely used in the fields of aviation, aerospace, micro-electronics nanotechnology, etc.…”

Section: Introductionmentioning

confidence: 99%

Study about Mechanical Property and Machinability of Polyimide

Yang

Zhao

et al. 2018

Polymers

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Polyimide (PI) is a kind of polymer material with properties of high heat-resistance and good mechanical strength. As a special engineering material, it has been widely used in the fields of aviation, nanotechnology, etc. PI has been regarded as one of the most promising engineering plastics in the future. Therefore, further research must be made on its mechanical properties and machinability of the PI, especially in ultra-precision machining. In this paper, both of the mechanical properties and machinability have been studied respectively. Through the nanoindentation experiment, the nanoindentation hardness and elastic modulus of PI are analyzed. Also, the single point diamond turning (SPDT) experiment is conducted to show that the form accuracy and surface roughness of PI surface can reach a submicron degree in peak-to-valley (PV) and a nanometer scale in surface roughness (Ra) respectively. The results demonstrate that the PI possesses good mechanical properties and machinability.

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Preparation and characterization of novel polyimide films containing amide groups

Cited by 33 publications

References 18 publications

Structures and properties of polyimide fibers containing ether units

Structures and properties of polyimide fibers containing ether units

Structure, property and knittability of polyimide filaments with various strength and modulus

Study about Mechanical Property and Machinability of Polyimide

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