2006
DOI: 10.1016/j.msea.2006.01.115
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Preparation and characterization of Ni–Mn–Ga high temperature shape memory alloy thin films using rf magnetron sputtering method

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Cited by 14 publications
(9 citation statements)
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“…Tuning the composition of Ni-Mn-Ga films has been achieved by means of various techniques like changing the target composition [3], the deposition temperature [4], the sputtering reactor pressure [20] or applying a negative bias voltage on the substrate [21].…”
Section: Introductionmentioning
confidence: 99%
“…Tuning the composition of Ni-Mn-Ga films has been achieved by means of various techniques like changing the target composition [3], the deposition temperature [4], the sputtering reactor pressure [20] or applying a negative bias voltage on the substrate [21].…”
Section: Introductionmentioning
confidence: 99%
“…The composition of the Ni-Mn-Ga thin film is Ni 48.8 Mn 27.2 Ga 24 . In order to determine the martensitic transformation temperature, DSC is attempted but no evident phase transformation peaks are detected due to a low thermal enthalpy and small mass (~1 mg) of thin film peeled off from the substrate [ 9 ]. To further determine the phases, the representative XRD pattern of the Ni 48.8 Mn 27.2 Ga 24 thin film annealed at 823 K for 1 hour is depicted in Figure 1 .…”
Section: Resultsmentioning
confidence: 99%
“…Sputtering process has been proved to be an efficient technique to deposit reproducible epitaxial films on various substrates. Tailoring the composition has been realized by using different techniques like changing the target composition [10], the deposition temperature [11], the sputtering reactor pressure [15] or applying a negative bias voltage on the substrate [16]. Varying the target composition is a quite simple route but preferential sputtering of Ni atoms occurs during the process [17].…”
Section: Introductionmentioning
confidence: 99%