Preparation and characterization of epitaxial films of silver, palladium and Ag-Pd alloys deposited by glow discharge sputtering I: Onto NaCl single-crystal substrates

Reniers, François; Delcambe, P.; Binst, L.; Jardinier‐Offergeld, M.; Bouillon, Florent

doi:10.1016/0040-6090(89)90620-2

Cited by 16 publications

(7 citation statements)

References 15 publications

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“…Ag-Pd alloy phase ring position confirming previous results [24], and the shift of the Ag and Pd peaks to one Ag-Pd peak in the XRD scan ( Figure 3). The SAED of Ag-Pd in the Ti-Si-C-Ag-Pd indicate small crystals while the SAED of the Ag-Pd top coating indicate large crystals.…”

Section: Microstructure and Compositionsupporting

confidence: 78%

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Contact Resistance of Ti-Si-C-Ag and Ti-Si-C-Ag-Pd Nanocomposite Coatings

Sarius

Lauridsen

Lewin

et al. 2011

Journal of Elec Materi

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Ti-Si-C-Ag-Pd and Ti-Si-C-Ag nanocomposite coatings were deposited by direct current magnetron sputtering on Cu substrates with an electroplated Ni layer. Analytical electron microscopy, x-ray diffraction and x-ray photoelectron spectroscopy show that the nanocomposites consist of TiC, Ag:Pd, and amorphous SiC. The contact resistance of these coatings against a spherical Au-Co surface was measured for an applied contact force up to 5 N. Ti-Si-C-Ag-Pd coatings with an Ag:Pd top coating has ~10 times lower contact resistance at contact forces below 1 N (~10 mΩ at ~0.1 N), and 2-3 times lower for contact forces around 5 N (<1 mΩ at 5 N), compared to the Ti-Si-C-Ag coating.

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Section: Microstructure and Compositionsupporting

confidence: 78%

“…The SEM images in Figure 2 [24][25][26]. This agrees with the Ag-Pd phase diagram that exhibits a fcc solid solution over the complete compositional range at temperatures lower than 962 °C (melting temperature of Ag) [27].…”

Section: Microstructure and Compositionsupporting

confidence: 68%

Contact Resistance of Ti-Si-C-Ag and Ti-Si-C-Ag-Pd Nanocomposite Coatings

Sarius

Lauridsen

Lewin

et al. 2011

Journal of Elec Materi

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“…We showed [1] that films deposited onto heated rocksalt (100) faces were heavily chloride contaminated even in the bulk. Figure 6 shows an AES spectrum of a silver-palladium alloy film deposited onto MgO (100) at 973 K. figure 7 proves the cleanliness of the surface.…”

mentioning

confidence: 99%

“…Asskali [5] obtained good epitaxial (100) palladium films onto MgO by glow discharge sputtering. We showed [1] that by simultaneous sputtering of both elements, it was possible to obtain monophase alloys at various concentrations.…”

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Study of epitaxial films of Ag, Pd and AgPd deposited by dc sputtering

Reniers

Kons

Delcambe

et al. 1990

Microsc. Microanal. Microstruct.

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Surface structure and composition of silver‐palladium alloys

Reniers

Jardinier‐Offergeld

Bouillon

1990

Surface & Interface Analysis

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560 EXTENDED ABSTRACTS -aO30 r(Si) clSi) -0.025 0 1 2 t~r n i n l 3 OD30 r(Si) m a025 0.020 0.01 5 0 1 2 ~Crninl 3 Figure 1. Sputter depth profiles of phosphorus, nitrogen and silicon for (a) (1 12) grain boundary and (b) (01 3) grain boundary. For a better comparison, the values of the relative peak-to-peak heights of the elements i and Fe (47 eV), r(i), are normalized by the bulk atomic concentrations, c(i).from Fig. l(b), this depletion is observed in the boundary layer only. The repelled atoms remain accumulated near the boundary. On the other hand, the 23 boundaries possess a very dense atomic arrangement with a very small excess of free volume, where less appropriate segregation sites for P can be accessible and a lower P segregation is observed. However, even relatively small deviations of the atomic configurations with respect to the perfect crystal in these cases are sufficient for a substantial increase of the Si concentration at these boundaries. From the point of view of some quantitative differences (low segregation of P and the depletion of Si at the (012) grain boundary), the grain boundary structure seems to be the most important condition controlling their chemical composition.Nitrogen segregates to all grain boundaries studied here and is practically unaffected by the boundary structure. Probably, it occupies the interstitial positions in the boundary, being apparently independent of both the structure of grain boundaries and the amount of other elements segregated there. REFERENCES 1. E. D. Hondros and M. P. Seah, lnt. Metall. Rev. 22, 262 2. C. L. Briant,Acta Metall. 31, 257 (1983).The surface properties of an alloy depend strongly on the surface composition. An Auger study of the silver-palladium system will bring a better understanding of the surface segregation processes in this alloy. The choice of this system is justified by:(1) the industrial applications of silver-palladium coatings(2) the great number of reactions catalysed by palladium;(3) the experience of the laboratory in IbVIIIb binary Two kinds of alloys were studied. In the low palladium concentration range (<20 at.%), we prepared massive single and large-grain crystals of alloys by the Bridgman method. Important solidification structures were detected and studied by Auger microscopy, electron microprobe and micro-(dentistry, electrical contacts, etc.); systems (Cu-Pd, Cu-Rh).hardness tests. An enrichment of palladium on the border of the solidification cells was observed. The centre of the cells was silver enriched.Samples in the whole range of concentrations, and particularly those rich in palladium, were prepared by condeneation of homogeneous epitaxial films of alloys on MgO(100) and NaCl( 100) by glow discharge sputtering. The epitaxial conditions for various systems are summarized in Table 1. Parallel epitaxy (lOO),[Ol 1],,//(100),[01 13, (where d stands for deposit and s for substrate) is always dominant, as observed by reflection electron diffraction. The film structure was also characterized by transmission electron dif...

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Preparation and characterization of epitaxial films of silver, palladium and Ag-Pd alloys deposited by glow discharge sputtering I: Onto NaCl single-crystal substrates

Cited by 16 publications

References 15 publications

Contact Resistance of Ti-Si-C-Ag and Ti-Si-C-Ag-Pd Nanocomposite Coatings

Contact Resistance of Ti-Si-C-Ag and Ti-Si-C-Ag-Pd Nanocomposite Coatings

Study of epitaxial films of Ag, Pd and AgPd deposited by dc sputtering

Surface structure and composition of silver‐palladium alloys

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