Preparation and analysis of micro-holes in C/SiC composites and ablation with a continuous wave laser

Zhang, Yunhai; Liu, Yongsheng; Cao, Liyang; Chen, Jie; Qiu, Guotao; Wang, Jing

doi:10.1016/j.jeurceramsoc.2020.08.033

Cited by 34 publications

(4 citation statements)

References 23 publications

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“…Figure 11B,D shows that during laser processing, grain growth is inevitable due to the continuous ablation of the laser beam. This phenomenon also appeared in other research, 18,19 and grain growth still occurs in LMDCE machining. As seen in Figure 11A, after laser processing in air, there are bare fibers inside the micropores and carbon particles and recrystallized silicon carbide particles remaining after decomposition.…”

Section: Laser Machining Combined With Dynamic Chemical Drilling Cmc-sicsupporting

confidence: 78%

“…During the laser ablation process, the Si in the CMC combines with the oxygen in the air to form SiO 2 oxide. [17][18][19] As the processing continues, a thick oxide layer forms on the machined surface, causing the surface of the material to oxidize. Zhai et al 20 prepared microstructures on SiC/SiC surfaces using a femtosecond laser and compared the processing morphologies with different parameters.…”

Section: Introductionmentioning

confidence: 99%

“…However, the fiber laser generates a large amount of heat during processing, 16 which causes serious ablation and oxidation of the SiC f /SiC material under high laser power; as a result, the material exhibits a poor surface quality and higher‐quality microhole processing cannot be achieved. During the laser ablation process, the Si in the CMC combines with the oxygen in the air to form SiO 2 oxide 17–19 . As the processing continues, a thick oxide layer forms on the machined surface, causing the surface of the material to oxidize.…”

Section: Introductionmentioning

confidence: 99%

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A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiC_f/SiC composites

Zhao

Sun

Zhang

et al. 2023

Int J Applied Ceramic Tech

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In this study, we used a novel method of laser machining combined with dynamic chemical liquid etching (LMDCE) to drill holes in 2.5D SiCf/SiC ceramic matrix composites (CMC‐SiC). A chemical solution that could quickly remove the recast layer without damaging the substrate was selected. Severe recast layer and microcrack defects were observed when laser machining was performed in the air. The surface of the material was highly carbonized due to the thermal effect of the laser. The effect of different defocus amounts and scanning speeds on the hole taper was studied. A lower scanning speed can ensure that a smaller taper is obtained by the microhole. The bore diameter of the holes processed with a defocusing amount of 0 or −1 mm is more uniform. The results show that with the assistance of a dynamic chemical solution, the fibers break neatly into needle‐like shapes, the thermal effect of the laser on the ceramic substrate is significantly weakened, the microhole shows good roundness, and there are no recast layers and oxides on the sample surface. In addition, microcracks are significantly reduced, and high‐quality microholes without a heat‐affected zone (HAZ) are machined. The method provides a new idea on how to eliminate machining defects and achieve higher‐quality micromachining for ceramic matrix composites.

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Section: Laser Machining Combined With Dynamic Chemical Drilling Cmc-sicsupporting

confidence: 78%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiC_f/SiC composites

Zhao

Sun

Zhang

et al. 2023

Int J Applied Ceramic Tech

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“…Laser processing is an efficient, non-contact, non-wear removal process, which can effectively avoid the defects of traditional processing methods, and has been used as the main technical means for processing carbon fiber ceramic matrix composites [ 17 , 18 , 19 , 20 ]. Liu et al [ 21 ] carried out millisecond laser hole-making experiments on C/SiC composites and revealed the changes in the surface morphology of the recast layer inside the microporous walls and evolution of fiber ablation.…”

Section: Introductionmentioning

confidence: 99%

Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites

et al. 2023

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Aiming at problems such as poor precision of laser processing C/SiC composites, low efficiency of grinding C/SiC composites, and serious wear of grinding wheel, a method of laser-grinding chain processing C/SiC composite groove was proposed in this paper. The method combined the high efficiency characteristic of laser ablating and the high precision characteristic of grinding. The relationship between laser processing parameters and the characteristics of ablative grooves was investigated, and the appropriate laser processing parameters were optimized, and then, to further improve the processing quality of the grooves, the grinding parameters optimization experiments of the grooves of C/SiC composites were carried out. The results showed that the C/SiC composites could be quickly removed by laser processing, and the grooves with relatively good size and shape accuracy could be obtained by laser parameters optimization experiments, but the side wall of the groove still had a certain inclination and the surface quality of the groove was yet poor; meanwhile, the size accuracy, shape accuracy, and surface quality of the grooves were greatly improved by further grinding. In addition, then, through the laser and grinding optimization experiments, the optimized parameters were obtained, where the laser power was 80 W, the scanning speed was 300 mm/s, the scanning frequency was 50 kHz, the scanning spacing was 25 μm, the depth of cut was 30 μm, the liner speed of wheel was 62.832 m/min, and the feed speed was 10 mm/min. With these parameters, the time used to process the groove with the laser-grinding chain was about 23/40 of the grinding process, and the quality of grooves could be guaranteed. Therefore, combined with the optimized process parameters, the laser-grinding chain processing scheme could be used to achieve high efficiency and precision grinding of C/SiC composite grooves.

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Effect of well-designed graphene heat conductive channel on the thermal conductivity of C/SiC composites

Zhang

Liu

Cao

et al. 2021

Ceramics International

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Preparation and analysis of micro-holes in C/SiC composites and ablation with a continuous wave laser

Cited by 34 publications

References 23 publications

A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiC_f/SiC composites

A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiC_f/SiC composites

Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites

Effect of well-designed graphene heat conductive channel on the thermal conductivity of C/SiC composites

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Preparation and analysis of micro-holes in C/SiC composites and ablation with a continuous wave laser

Cited by 34 publications

References 23 publications

A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiCf/SiC composites

A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiCf/SiC composites

Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites

Effect of well-designed graphene heat conductive channel on the thermal conductivity of C/SiC composites

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A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiC_f/SiC composites

A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5D SiC_f/SiC composites