Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling

Li, Guangshu; Wang, Chaohui; Zhang, Huanyu; Zhuang, Mingxiang; Hu, Zhongchao; Liu, Yao; Wang, Liang

doi:10.1016/j.matlet.2020.128598

Cited by 9 publications

(3 citation statements)

References 11 publications

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“…The design of the buffer layer also has some applications in other packaging technologies. For example, Li et al [ 125 ] developed a novel aluminum nitride composite coating, AACC, as a buffer layer to effectively reduce the thermal mismatch between the chip and the heat sink W-Cu. The authors also mentioned that, by adjusting the ratio of AIN to AI, new composite coatings with variable CTE can also be formed.…”

Section: The Most Recent Solutions For Delamination Failurementioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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Section: The Most Recent Solutions For Delamination Failurementioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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“…Al 2 O 3 is the most widely used, and cordierite, whose properties have been improved, can be a competitor to Al 2 O 3 due to its cost-effectiveness and ease of production. [19][20][21][22] Various additives can be added to improve some properties of cordierite. In this study, h-BN as an additive was used.…”

Section: Introductionmentioning

confidence: 99%

“…The most mentioned ceramic materials in this field are Beryllium oxide (BeO), Silicon carbide (SiC), Alumina (Al 2 O 3 ), and Aluminum Nitride (AlN). Al 2 O 3 is the most widely used, and cordierite, whose properties have been improved, can be a competitor to Al 2 O 3 due to its cost‐effectiveness and ease of production 19–22 …”

Section: Introductionmentioning

confidence: 99%

Characterization of cordierite based h‐BN doped ceramics as an electronic substrate/circuit board material

Tekin

Ercenk

Yılmaz

et al. 2022

Int J Applied Ceramic Tech

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In this study, h-BN was added to the cordierite composition obtained from zeolite, which was prepared by the determined stoichiometry to facilitate machinability and increase thermal conductivity. Sintering behavior, hardness, machinability, and thermal/electrical properties of the samples obtained by sintering the compounds at different times were investigated. Thanks to these features, it is aimed to use cordierite as an alternative material to integrated circuit substrates and electronic packaging materials. The produced samples were analyzed by X-ray diffraction analysis, examined by scanning electron microscopy, and field emission scanning electron microscopy. Afterward, thermal properties such as thermal diffusivity, thermal conductivity, and electrical properties such as electrical conductivity and dielectric permittivity were measured. The hardness and machinability of samples were investigated. Cordierite, spinel, glassy phase, and h-BN phase were detected, and it was observed that the blocky cordierite grains turned into equiaxed grains with the increase of the h-BN. According to the results obtained from the thermal conductivity test, it was seen that the h-BN additive increased the thermal conductivity value in general. In addition, it was determined that with the increase of h-BN, the hardness decreased, and the machinability properties of the samples improved.

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