Delamination of Plasticized Devices in Dynamic Service Environments
Wenchao Tian,
Xuyang Chen,
Guoguang Zhang
et al.
Abstract:With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moistu… Show more
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