2010
DOI: 10.1016/j.mee.2009.05.010
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Prediction of nanopattern topography using two-dimensional focused ion beam milling with beam irradiation intervals

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Cited by 24 publications
(9 citation statements)
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“…After ZnO thin film removal it was observed that the topography obtained in the hybrid photonic crystal was transferred to the silicon substrate. In fact, this PhC topography has been predicted in previous theoretical investigations for FIB fabrication method (Han, Lee, Min & Lee, 2010). Figure 3 shows a close view of the photonic structure after ZnO thin film removal.…”
Section: Resultssupporting
confidence: 78%
“…After ZnO thin film removal it was observed that the topography obtained in the hybrid photonic crystal was transferred to the silicon substrate. In fact, this PhC topography has been predicted in previous theoretical investigations for FIB fabrication method (Han, Lee, Min & Lee, 2010). Figure 3 shows a close view of the photonic structure after ZnO thin film removal.…”
Section: Resultssupporting
confidence: 78%
“…Test structures were milled assuming a linear relationship between pixel intensity and milling depth. The varying nanofunnel width, however, was found to cause deviation from a linear milling rate, likely due to the dependence of sputtering yield on the beam angle of incidence and the impact of feature dimensions on material redeposition 37 . The pixel intensities in the bitmap image were therefore empirically adjusted to compensate for these nonlinear effects, resulting in a nearly uniform aspect ratio (depth:width) along the entire length of the nanofunnel.…”
Section: Methodsmentioning
confidence: 99%
“…The milled feature's profile decreases as the depth increases due to several characteristics of the milling process: the Gaussian-like beam profile, the sputtering yield dependence on the angle of incidence (self-focusing), and the redeposition of material. 24,25 Third, it protects the substrate's top surface from redeposition of material and structural deformations typically observed along the edges of features milled directly into substrates. 26 Following the milling of channels into the substrate underlying the metal film, the metal is removed using a chemical etch and the nanoscale features are sealed with a cover plate to yield the final nanochannels.…”
mentioning
confidence: 99%