2011
DOI: 10.1109/tdmr.2011.2159117
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Predicting the Failure Probability of Device Features in MEMS

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Cited by 4 publications
(2 citation statements)
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“…In 2011, Fitzgerald's model was further explored by proposing the concept of structural failure probability density (FPI). According to the stress distribution on the surface of the structure, the FPI quantified the failure probability of different parts of the microstructure [121]. Based on Fitzgerald's model, K Nagayoshi obtained similar results through stretching and bending experiments on single crystal silicon samples in 2010 [122].…”
Section: • Reliability Quantification For General Structuresmentioning
confidence: 97%
“…In 2011, Fitzgerald's model was further explored by proposing the concept of structural failure probability density (FPI). According to the stress distribution on the surface of the structure, the FPI quantified the failure probability of different parts of the microstructure [121]. Based on Fitzgerald's model, K Nagayoshi obtained similar results through stretching and bending experiments on single crystal silicon samples in 2010 [122].…”
Section: • Reliability Quantification For General Structuresmentioning
confidence: 97%
“…Similar to analog electronic systems, the mechanical components of MEMS have nonlinear nature. Therefore, analog and mixed signal tests [28] including verification and calibration are essential for MEMS. The test problem for MEMS is exacerbated due to their inherent diverse properties.…”
Section: Difference Between Ics and Mems Testingmentioning
confidence: 99%