Practical Evaluation for Long-Term Stability of Thermal Interface Material

Chen, C.I.; Ni, Ching-Yu; Pan, Hsien-Yu; Chang, Chia‐Jui; Liu, D.S.

doi:10.1111/j.1747-1567.2008.00343.x

Cited by 15 publications

(3 citation statements)

References 3 publications

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“…Very importantly, they may or may not employ a high humidity environment to simulate important moisture interactions. The performance of TIMs in this test varies greatly depending on the TIM and junction materials, showing both enhanced and hindered performance over the course of treatment [312][313][314][315][316][317][318][319]. Likewise, a TIM can either experience enhancement from humidity that results from increased wetting or experience impairment of the adhesion ability of the polymer matrix [313,320].…”

Section: Lifespan Reliability and Performancementioning

confidence: 99%

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

et al. 2021

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We review the current state-of-the-art graphene-enhanced thermal interface materials for the management of heat in the next generation of electronics. Increased integration densities, speed and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and high-powered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of composites, while simultaneously preserving electrical insulation. A hybrid filler approach, using graphene and boron nitride, is presented as a possible technology providing for the independent control of electrical and thermal conduction. The reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of graphene-enhanced thermal interface materials compared to alternative technologies.

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Section: Lifespan Reliability and Performancementioning

confidence: 99%

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

et al. 2021

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“…A TIM suffers catastrophic failures over the course of its lifespan because, in case the of non-curing types, it has been pumped out of the junction, and in C 2020, 6, 26 3 of 15 the case of curing types, it has cracked due to thermal stresses-both stemming from expansions and contractions [6,43]. However, the long-term, intrinsic performance of TIMs irrespective of the junctions in which they are applied has received far less consideration [44][45][46][47][48][49][50][51][52]. TIM intrinsic performance may alter due to numerous factors, including chemical and physical alterations of either the polymer matrix or the filler materials.…”

Section: Introductionmentioning

confidence: 99%

Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials

Lewis

Perrier

Mohammadzadeh

et al. 2020

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We report on the lifespan evolution of thermal diffusivity and thermal conductivity in curing epoxy-based thermal interface materials with graphene fillers. The performance and reliability of graphene composites have been investigated in up to 500 power cycling measurements. The tested composites were prepared with an epoxy resin base and randomly oriented fillers consisting of a mixture of few-layer and single-layer graphene. The power cycling treatment procedure was conducted with a custom-built setup, while the thermal characteristics were determined using the “laser flash” method. The thermal conductivity and thermal diffusivity of these composites do not degrade but instead improve with power cycling. Among all tested filled samples with different graphene loading fractions, an enhancement in the thermal conductivity values of 15% to 25% has been observed. The obtained results suggest that epoxy-based thermal interface materials with graphene fillers undergo an interesting and little-studied intrinsic performance enhancement, which can have important implications for the development of next-generation thermal interface materials.

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“…Very importantly, they may or may not employ a high humidity environment to simulate important moisture interactions. The performance of TIMs in this test varies greatly depending on the TIM and junction materials, showing both enhanced and hindered performance over the course of treatment [258][259][260][261][262][263][264][265]. Likewise, a TIM can either experience enhancement from humidity resultant from increased wetting or experience harm the adhesion ability of the polymer matrix [259,266].The lack of consistency in this type of procedure has numerous causes from differences in the procedure, different materials, chemical degradation, and physical form changes.…”

Section: Lifespan Reliability and Performancementioning

confidence: 99%

Review of Graphene-based Thermal Polymer Nanocomposites: Current State of the Art and Future Prospects

Lewis¹,

Perrier²,

Barani³

et al. 2020

Preprint

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We review the current state-of-the-art of graphene-enhanced thermal interface materials for the management of heat the next generation of electronics. Increased integration densities, speed, and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and highpowered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of the composites while simultaneously preserving electrical insulation. A hybrid filler graphene and boron nitride approach is presented as possible technology for independent control of electrical and thermal conduction. Reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of the graphene-enhanced thermal interface materials as compared to alternative technologies.

show abstract

Practical Evaluation for Long-Term Stability of Thermal Interface Material

Cited by 15 publications

References 3 publications

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials

Review of Graphene-based Thermal Polymer Nanocomposites: Current State of the Art and Future Prospects

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