Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

Abstract

We review the current state-of-the-art graphene-enhanced thermal interface materials for the management of heat in the next generation of electronics. Increased integration densities, speed and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and high-powered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of composites, while simultaneously preserving electrical insulation. A hybrid filler approach, using graphene and boron nitride, is presented as a possible technology providing for the independent control of electrical and thermal conduction. The reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of graphene-enhanced thermal interface materials compared to alternative technologies.

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

“…It was also established that few-layer graphene (FLG) maintains high thermal conductivity, similar to bulk graphite owing to its smooth surface and, as a result, insignificant reduction in thermal conductivity due to the phonon—boundary scattering [ 27 , 28 , 29 , 30 ]. A mixture of single-layer graphene and FLG demonstrated the largest enhancement in the thermal conductivity of the TIM composites [ 19 , 20 , 31 , 32 , 33 , 34 , 35 , 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 , 46 , 47 , 48 , 49 ]. In the context of thermal research and TIMs, we will refer to the processed mixture of graphene and FLG flakes with lateral dimensions in several μm range as graphene fillers .…”

Flexible hematite (α-Fe2O3)-graphene nanoplatelet (GnP) hybrids with high thermal conductivity

“…Even though single layer graphene has excellent thermal conductivity of about 5300 W/m K [45], outperforming other nanocarbon materials [50], the GnPs are more like graphite flakes with much lower thermal conductivity [51,52]. With proper dispersion, alignment and using specific polymer matrices that can tolerate large concertation of GnPs without compromising flexibility and workability, conformal TIM films or coatings can be produced with thermal conductivities approaching 10 W/mK [53][54][55]. Hybrid systems can help reduce bulk contact resistance between the polymer and a particular filler.…”

Effect of Graphite Filler Type on the Thermal Conductivity and Mechanical Behavior of Polysulfone-Based Composites

“…Carbon nanoparticles have recently been actively used as fillers for thermoplastic matrices, including polymethyl methacrylate [18], polypropylene [19][20][21], ethylene vinyl acetate [22], polyamide [23,24], polyurethane [25], polysulfone [26,27], polyethersulfone [28] and other thermoplastics. The types and structures of carbon nanofillers are demonstrated to have a considerable impact on the characteristics of the resulting composite materials; however, evidence on the nature of this effect is conflicting.…”