Power Module on Copper Lead Frame with Novel Sintering Paste and SnSb solder

Wai, Leong Ching; Yamamoto, Kazuya; Boon, Simon Lim Siak; Yue, Tang Gong

doi:10.1109/eptc50525.2020.9315011

Cited by 5 publications

(3 citation statements)

References 2 publications

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“…In terms of innovations, Insulated Metal Substrate (IMS) has better thermal performance than PCB and lower manufacturing costs than traditional DBC substrate 223,224 . New substrates are also evolving toward thinner structures, for both conductive layers (lead‐frame technology) 225 and ceramics (thin‐film insulation technology), 226 thus improving the thermal behavior of the structure and facilitating component integration. Layer 6: Base‐plate (Figure 16A‐⑥). A metallic (copper or aluminum alloy) surface, whose main function is to provide mechanical support to the rest of layers, as well as to absorb and homogeneously to distribute heat over the entire surface of the inorganic substrate, so as to transmit it to the cooling liquid 137,206 …”

Section: Internal Structure and Characteristics Of Power Modulesmentioning

confidence: 99%

“…221 In terms of innovations, Insulated Metal Substrate (IMS) has better thermal performance than PCB and lower manufacturing costs than traditional DBC substrate. 223,224 New substrates are also evolving toward thinner structures, for both conductive layers (leadframe technology) 225 and ceramics (thin-film insulation technology), 226 thus improving the thermal behavior of the structure and facilitating component integration. • Layer 6: Base-plate (Figure 16A-⑥).…”

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confidence: 99%

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The role of power device technology in the electric vehicle powertrain

Robles

Matallana

Aretxabaleta

et al. 2022

Intl J of Energy Research

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Summary In the automotive industry, the design and implementation of power converters and especially inverters, are at a turning point. Silicon (Si) IGBTs are at present the most widely used power semiconductors in most commercial vehicles. However, this trend is beginning to change with the appearance of wide‐bandgap (WBG) devices, particularly silicon carbide (SiC) and gallium nitride (GaN). It is therefore advisable to review their main features and advantages, to update the degree of their market penetration, and to identify the most commonly used alternatives in automotive inverters. In this paper, the aim is therefore to summarize the most relevant characteristics of power inverters, reviewing and providing a global overview of the most outstanding aspects (packages, semiconductor internal structure, stack‐ups, thermal considerations, etc.) of Si, SiC, and GaN power semiconductor technologies, and the degree of their use in electric vehicle powertrains. In addition, the paper also points out the trends that semiconductor technology and next‐generation inverters will be likely to follow, especially when future prospects point to the use of “800 V" battery systems and increased switching frequencies. The internal structure and the characteristics of the power modules are disaggregated, highlighting their thermal and electrical characteristics. In addition, aspects relating to reliability are considered, at both the discrete device and power module level, as well as more general issues that involve the entire propulsion system, such as common‐mode voltage.

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Section: Internal Structure and Characteristics Of Power Modulesmentioning

confidence: 99%

mentioning

confidence: 99%

The role of power device technology in the electric vehicle powertrain

Robles

Matallana

Aretxabaleta

et al. 2022

Intl J of Energy Research

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“…Zhou Xusheng and his team [20] studied stainless-steel soldering and suggested that the Sn-3.5Ag-0.7Cu alloy exhibits excellent mechanical properties and weldability, good wetting and spreading performance with stainless steel, high strength, and beautiful solder joints; however, the precious metal Ag greatly increases the price of this solder, hindering its application. Numerous scholars began to study Sn-Sb [21] solder and Sn-Cu [22] solder, though the wettability of these solders on stainless-steel plates is poor. On the other hand, the corrosion resistance of solders has not been investigated by these scholars.…”

Section: Introductionmentioning

confidence: 99%

Study on Corrosion Resistance of Stainless-Steel Welded Joints with SnSb8Cu4 and SnZn9

Wang¹,

Wang

Wang³

et al. 2023

Materials

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The use of soldering based on metallurgical bonding, as opposed to conventional rubber sealing, is capable of achieving the firm sealing of stainless-steel subway car bodies, though the corrosion resistance of such joints has rarely been investigated. In this study, two typical solders were selected and applied to the soldering of stainless steel, and their properties were investigated. As indicated by the experimental results, the two types of solder exhibited favorable wetting and spreading properties on stainless-steel plates, and successfully achieved sealing connections between the stainless-steel sheets. In comparison with the Sn-Zn9 solder, the Sn-Sb8-Cu4 solder exhibited lower solidus–liquidus, such that it can be more suitably applied to low-temperature sealing brazing. The sealing strength of the two solders reached over 35 MPa, notably higher than that of the sealant currently used (the sealing strength is lower than 10 MPa). In comparison with the Sn-Sb8-Cu4 solder, the Sn-Zn9 solder exhibited a higher corrosion tendency and a higher degree of corrosion during the corrosion process.

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