2001
DOI: 10.1016/s0026-2714(01)00197-4
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Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter

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Cited by 24 publications
(14 citation statements)
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“…These failures are mainly induced by power and thermal cycling of the semiconductor device [18]. For example, an interesting investigation conducted on a Renault Kangoo electric vehicle has been carried out in [19]. The authors have demonstrated that direct silicon temperature measurement of an operating traction inverter is feasible.…”
Section: Iipower Electronic Architecture Tolerant To Semiconductor Fmentioning
confidence: 99%
See 1 more Smart Citation
“…These failures are mainly induced by power and thermal cycling of the semiconductor device [18]. For example, an interesting investigation conducted on a Renault Kangoo electric vehicle has been carried out in [19]. The authors have demonstrated that direct silicon temperature measurement of an operating traction inverter is feasible.…”
Section: Iipower Electronic Architecture Tolerant To Semiconductor Fmentioning
confidence: 99%
“…The switching losses are an important part of the semiconductor power losses [44]. Reducing these losses is important to improve the inverter reliability because thermal stress is a key factor of the failure mechanism [19]. For the same reason, ensuring fair switching repartition is crucial.…”
Section: Control Drive Requirementsmentioning
confidence: 99%
“…Fig. 4 shows the results from fitting Eqs (2)(3)(4)(5) to each phase of an individual pack for IGBTs (a) and diodes (b), respectively. From both graphs, a quite good description of the physical behaviour is observed in the 50 to 400 A range.…”
Section: Tsp Calibration At High Currentmentioning
confidence: 99%
“…While diodes are always working under this current value, IGBTs are usually over this current. Regardless of the real physical meaning of Eqs (2)(3)(4)(5), the temperature extraction can be accurately performed for low current ranges (up to 50 A per phase), in comparison to taking into account a linear relationship. However, Eqs.…”
Section: Tsp Calibration At High Currentmentioning
confidence: 99%
“…Therefore, promoting thermal studies at chip level is fundamental for a better understanding of ERTC failures and for increasing its lifetime (Coquery et al, 2001). In fact, the key point is to monitor the temperature inside a power module under a thermal working condition representative of the final application.…”
mentioning
confidence: 99%