2005
DOI: 10.1117/12.607428
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Power-limiting mechanisms in VECSELs

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Cited by 33 publications
(20 citation statements)
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“…Applying similar design principles, but using a combination of large pump spot sizes (0.5-0.9 mm) and thin-devices on diamond submounts for heat removal, very impressive performance from ∼ 980 nm and 1060 nm SDLs have been achieved [14,46,76,77]. The highest powers recorded to-date reach 30 W at 980 nm with a multimode beam (M 2 ∼ 3) [14] and 12 W at 1060 nm with TEM 00 emission [77].…”
Section: Nm-1100 Nm Sdlsmentioning
confidence: 78%
See 1 more Smart Citation
“…Applying similar design principles, but using a combination of large pump spot sizes (0.5-0.9 mm) and thin-devices on diamond submounts for heat removal, very impressive performance from ∼ 980 nm and 1060 nm SDLs have been achieved [14,46,76,77]. The highest powers recorded to-date reach 30 W at 980 nm with a multimode beam (M 2 ∼ 3) [14] and 12 W at 1060 nm with TEM 00 emission [77].…”
Section: Nm-1100 Nm Sdlsmentioning
confidence: 78%
“…The power-scalability of single chip SDLs is expected to be limited by thermal constraints as discussed in paragraph 2.2. and references [11,76,98] or by laser action in the semiconductor plane [76]. Heatspreader-bonded devices show reduced thermal resistance for small spot sizes compared to their thin-device counterparts with the difference increasing with mirror thermal resistance [54].…”
Section: Power Scalingmentioning
confidence: 99%
“…The 2 Â 2 mm 2 samples separated from the wafers were joined with the diamond plates using capillary bonding (Liau 2000). The shapes of the semiconductor samples were intentionally irregular in order to suppress possible lasing in the lateral direction (Bedford et al 2005). The bonding took place at the room temperature and the samples were left under tension in order to totally accomplish the process.…”
Section: Methodsmentioning
confidence: 99%
“…Pump beams are typically highly spatially multimoded, only an approximately uniform pump light distribution is required across the VECSEL laser mode aperture. If the pump spot becomes too large in diameter, in-plane amplified spontaneous emission (ASE) can potentially deplete laser gain [159]. Such in-plane ASE, if not controlled, will limit the lateral size of the laser pump spot and thus limit scaling of the output power of the laser.…”
Section: 33mentioning
confidence: 99%
“…Output power scaling of VECSELs will continue to be a topic of interest. Power scaling can utilize a number of approaches, such as increasing mode area and pump spot size while controlling and limiting the in-plane amplified spontaneous emission that can deplete the gain [159]. Further improvements in efficient heat removal (Chapter 2) will help, such as using the highest thermal conductivity diamond heat spreaders and heat sinks [107], front and back side heat removal from the OPS chip, design and fabrication of low thermal impedance semiconductor structures, and so on.…”
Section: Current and Future Research Directionsmentioning
confidence: 99%