Power consumption reduction scheme of magnetic microactuation using electroplated Cu–Ni nanocomposite

Huang, Yu; Chao, Tzu Yuan; Chen, C. C.; Cheng, Yu‐Ting

doi:10.1063/1.2748301

Cited by 17 publications

(13 citation statements)

References 20 publications

(7 reference statements)

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“…Cu–Ni alloys have attracted the attention of electroplaters due to their anticorrosion and antifouling properties, electrocatalytic properties, as well as their high tensile strength and reasonably good wear resistance 16, 17. This combination of properties makes Cu–Ni thin films suitable for many applications, such as resistive and thermoelectric devices or MEMS 18, 19. Moreover, either ferromagnetic or nonmagnetic behavior is possible in this alloy by properly tuning the composition of the Cu–Ni solid solution.…”

Section: Introductionmentioning

confidence: 99%

Nanocrystalline Electroplated Cu–Ni: Metallic Thin Films with Enhanced Mechanical Properties and Tunable Magnetic Behavior

Pellicer

Varea

Pané

et al. 2010

Adv Funct Materials

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Nanocrystalline 3 µm thick Cu1–xNix (0.45 ≤ x ≤ 0.87) films are electrodeposited galvanostatically onto Cu/Ti/Si (100) substrates, from a citrate‐ and sulphate‐based bath containing sodium lauryl sulphate and saccharine as additives. The films exhibit large values of reduced Young's modulus (173 < Er < 192 GPa) and hardness (6.4 < H < 8.2 GPa), both of which can be tailored by varying the alloy composition. The outstanding mechanical properties of these metallic films can be ascribed to their nanocrystalline nature—as evidenced by X‐ray diffraction, transmission electron microscopy, and atomic force microscopy—along with the occurrence of stacking faults and the concomitant formation of intragranular nanotwins during film growth. Due to their nanocrystalline character, these films also show very low surface roughness (root mean square deviation of around 2 nm). Furthermore, tunable magnetic properties, including a transition from paramagnetic to ferromagnetic behavior, are observed when the Ni percentage is increased. This combination of properties, together with the simplicity of the fabrication method, makes this system attractive for widespread technological applications, including hard metallic coatings or magnetic micro/nano‐electromechanical devices.

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Section: Introductionmentioning

confidence: 99%

Nanocrystalline Electroplated Cu–Ni: Metallic Thin Films with Enhanced Mechanical Properties and Tunable Magnetic Behavior

Pellicer

Varea

Pané

et al. 2010

Adv Funct Materials

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“…Previously, we had reported a Cu-Ni nanocomposite for low power magnetic microactuation [1,2]. Via the incorporation of Ni ferromagnetic nanopartic1es into Cu matrix, the magnetic characteristic of the Cu can be modified from diamagnetism to ferromagnetism.…”

Section: Introductionmentioning

confidence: 99%

The electromigration investigation of Cu-Ni nanocomposites

Chen

Chu

Chao

et al. 2012

2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

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The paper presents the electromigration behavior study of Cu-Ni nanocomposite for low-power electromagnetic microactuator fabrication. The nanocomposite is characterized based the striped with 50�m width and synthesized in the Cu plating bath with the 2g!L concentration of 50nm Ni nanopowders. About 2.03% Ni weight percentage in the Cu-Ni nanocomposite stripe is characterized using inductively coupled plasma mass spectrometer (ICP-MS). The drift velocity, critical length, critical product, and activation energy of the Cu-Ni nanocomposite are 565nm/hr, 14�m, 1714 A/cm, and 0.3geV respectively. In comparison with the values of Cu which are 88nm/hr, 20�m, 2365 A/cm, and 1.0ge V, respectively, the poor electromigration behavior of the nanocomposite is dominated by the surface diffusion mechanism of Cu atoms due to the void formation in the interface between itself and the passivation oxide.

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“…Enhanced corrosion, tribological, and mechanical properties were the main research focus of the automotive and aerospace industries in the 1970s-1990s, leading to significant technological advancements. In the early 2000s, some of the focus started to shift to electrical components and electronic devices [5][6][7][8][9][10]. As the accessibility of nanoparticles continues to rise, the interest in reduced cost and low-temperature electrodeposited MMCs continues to escalate [2].…”

Section: Introductionmentioning

confidence: 99%

“…The electroplating of copper alloy films has an instrumental role in many different industry-related applications. For instance, electroplating has found a niche in microelectromechanical systems (MEMS) because the process can deposit different alloys onto depressed and oddly shaped geometric substrates [5,6,10,45]. Cu-Ni coatings have been evaluated for use as inert anodes in the fabrication of aluminum because of their enhanced electrical and thermal conductivity [8,9].…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Cu–Ni Composite Coatings

Thurber¹,

Mohamed²,

Golden³

2016

Electrodeposition of Composite Materials

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The electrodeposition of Cu-Ni incorporated with nano-to microparticles to produce metal matrix composites has been reviewed in this chapter. The inclusion of particles into the metal matrix produced enhanced properties in the areas of electronics, mechanics, electrochemistry, and corrosion. In electronics, an increase in the magnetic properties and durability for microactuators was observed. Measurements of the mechanical properties showed an increase in hardness, wear resistance, shear adhesion, and tensile strength for the material. The corrosion resistance of the metal matrix coatings was improved over that of pure Cu-Ni. As the accessibility of nanoparticles continues to increase, the interest in reduced cost and low-temperature electrodeposited metal matrix composites continues to rise. However, only a small number of articles have investigated Cu-Ni composite coatings; these composite coatings need further examination due to their advantageous properties.

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Power consumption reduction scheme of magnetic microactuation using electroplated Cu–Ni nanocomposite

Cited by 17 publications

References 20 publications

Nanocrystalline Electroplated Cu–Ni: Metallic Thin Films with Enhanced Mechanical Properties and Tunable Magnetic Behavior

Nanocrystalline Electroplated Cu–Ni: Metallic Thin Films with Enhanced Mechanical Properties and Tunable Magnetic Behavior

The electromigration investigation of Cu-Ni nanocomposites

Electrodeposition of Cu–Ni Composite Coatings

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