2004
DOI: 10.1063/1.1805719
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Power and temperature dependence of low frequency noise in AlGaN∕GaN transmission line model structures

Abstract: The low-frequency noise in AlGaN/ GaN transmission line model structures has been investigated for a wide range of ambient temperatures and dissipated powers. A deviation of low-frequency noise from a 1 / f dependence has been observed upon increasing the applied voltage. The effect correlates with the nonlinearity of current-voltage characteristics (CVC). The concept of nonequilibrium 1 / f noise has been introduced to explain 1 / f noise enhancement. A qualitative model connecting non-equilibrium noise with … Show more

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Cited by 11 publications
(13 citation statements)
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References 22 publications
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“…2a have a broader frequency distribution than predicted by equation (1). To illustrate this fact, let us make a comparison of one of the normalized GR spectra with the theoretical curve calculated by (1) and presented in the corresponding coordinates (Fig.…”
Section: Resultsmentioning
confidence: 95%
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“…2a have a broader frequency distribution than predicted by equation (1). To illustrate this fact, let us make a comparison of one of the normalized GR spectra with the theoretical curve calculated by (1) and presented in the corresponding coordinates (Fig.…”
Section: Resultsmentioning
confidence: 95%
“…A set of ohmic contacts in the TLM layout was processed afterwards with a width of 100 µm and a distance between contacts varying from 5 µm to 25 µm. As a difference with respect to structures investigated earlier [1] an additional 1.5 nm thick AlN barrier layer was grown between the Al 0.33 Ga 0.67 N barrier of 15 nm thickness and the GaN layer. The sheet concentration of the electrons in this channel measured by the Van der Pauw method was found to be 1.3⋅10…”
Section: Methodsmentioning
confidence: 99%
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“…A linear dependence is shown for dissipated powers ranging from 0.01 W to 0.5 W. As reported in Ref. [11], the contact spacings do not affect this dependence. Furthermore, no clear difference is observed between these devices realized on Si-on-polySiC and devices realized on thick silicon; a slightly lower resistance change is noticed for devices realized with similar structures grown on 4H-SiC substrate due to enhanced heat transfer towards the substrate.…”
Section: Gan Buffermentioning
confidence: 58%
“…To evaluate the influence of the heat transfer on the electrical properties, we measured the dependence of resistance change with the power dissipated inside Transmission Line Measurement (TLM) devices [11]. For this, I-V curves between ohmic contacts are measured and the resistance is calculated for each bias varying from 0.1 V up to 10 V typically.…”
Section: Gan Buffermentioning
confidence: 99%