2008
DOI: 10.1109/tns.2008.2006972
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Post-Irradiation Annealing Mechanisms of Defects Generated in Hydrogenated Bipolar Oxides

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Cited by 21 publications
(2 citation statements)
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“…The two-stage hydrogen model incorporates hydrogen release mechanisms as well as the Nit formation due to hydrogen depassivation of Si-H bonds near the interface as proposed by McLean et al [8] After exposure to ionizing radiation, excess hydrogen released in devices would be trapped in the oxide with affecting the densities of Not. [9] Addition-ally, hydrogen molecules cracking at oxide trapped charges, releasing hydrogen to enhance Nit buildup, are included in the theoretical calculation. [7] Simultaneously the annealing of Nit is controlled by the passivation of interfacial defects by hydrogen molecules.…”
Section: Introductionmentioning
confidence: 99%
“…The two-stage hydrogen model incorporates hydrogen release mechanisms as well as the Nit formation due to hydrogen depassivation of Si-H bonds near the interface as proposed by McLean et al [8] After exposure to ionizing radiation, excess hydrogen released in devices would be trapped in the oxide with affecting the densities of Not. [9] Addition-ally, hydrogen molecules cracking at oxide trapped charges, releasing hydrogen to enhance Nit buildup, are included in the theoretical calculation. [7] Simultaneously the annealing of Nit is controlled by the passivation of interfacial defects by hydrogen molecules.…”
Section: Introductionmentioning
confidence: 99%
“…In pre vi ous years, many au thors have ana lysed an neal ing in sil i con semi con duc tor de vices [3][4][5][6][7][8][9][10][11][12][13][14][15][16][17]. The main fo cus was on re search of an neal ing in MOS tran sis tors and in te grated cir cuits [4][5][6][7][11][12][13][14][15]], yet con sid er able at ten tion was also paid for the time-depend ent ra di a tion ef fects in bi po lar de vices and re lated field ox ides [3,8,10]. Ra di a tion re sponse of an in tegrated cir cuit is very com plex, be ing af fected by the char ac ter is tics of its tran sis tors (MOSFET or bi po lar, sil i con or heterojunction, etc.…”
Section: Introductionmentioning
confidence: 99%