POSS‐based molecular hybrids with low dielectric constant: Effect of chemical structure and molecular architecture

Abstract

Three kinds of hybrids with different architectures including dumbbell-type, bead-type, and cross-linked structure, were prepared via the Heck reaction between octavinyl-polyhedral oligomeric silsesquioxane (OV-POSS) and different bromo-substituted aromatic amide monomers. The molecular architecture can be successfully achieved by simply varying the feed ratio of OV-POSS to monomers. Their structure and properties were characterized by FTIR, 1 H NMR, 29 Si NMR, provide the expansion for FTIR and NMR] All the POSS-based hybrids exhibited good thermal stability and low dielectric constant properties. The relationship between chemical structure, molecular architecture, and the dielectric constant of these hybrids were investigated in detail. The results show that POSS content dominated the low dielectric constant of the hybrids, while the chemical structure of organic chains and molecular architecture also play an important role on the formation of low dielectric constant.

Synthesis and Characterization of Trifluoroethoxy Polyphosphazenes Containing Polyhedral Oligomeric Silsesquioxane (POSS) Side Groups

“…These values decrease steadily with the increased loading of the POSS-NH– groups because the POSS-based solids possess what is essentially a nanoporous structure. This can effectively decrease the dielectric constant due to the increased free volume in these polymers. ,, Specifically, the high porosity of the POSS-polyphosphazene-TFE systems result from the nanometer scale porous structure surrounding the POSS units, and this markedly reduces the dielectric constant.…”

“…The frequency used for the DEA experiments was 100 kHz, and the capacitance (ε) was monitored at 25 °C. The permittivity (ε) was calculated based on the equation where ε is the dielectric constant, C is the capacitance, d is the thickness of the films, A is the area of top Ag electrode, and ε 0 is the permittivity of free space …”

“…These structures are known to impart a number of favorable properties when linked to classical organic polymers and can lead to dramatic improvements in polymer characteristics such as high thermal and chemical stability, enhanced mechanical behavior, flame retardancy, oxidation resistance, and high gas permeability as well as changes in dielectric behavior and thermal conductivity. Moreover, they can also change the crystallization behavior and surface wetting properties of polymers. − POSS-containing polymers have also been studied for utilization in bio-related applications, − optical products, liquid crystals, proton exchange membranes, , low-dielectric constant materials, , gas transport, antifouling, and self-cleaning surfaces. − …”

Preparation and Properties of Novel Cross‐Linked Fluorinated Poly(aryl ether) with Low Dielectric Constant and High Thermal Stability

“…[9,10] Therefore, most studies reported in recent years have focused on the hightemperature resistant polymeric dielectric materials with excellent heat resistance and stability of thermal movement of molecular chains. [11][12][13][14] To develop various high-temperature resistant, low dielectric constant, and low dielectric loss polymeric materials with different structures, many efforts have been done including the introduction of cross-linked network into molecular chain [15][16][17][18][19][20][21][22][23] and the promotion of thermal conductivity. [24][25][26] Fluorinated poly(aryl ether) (FPAE), as high performance polymeric material, [27,28] has been widely studied owing to their high thermal stability, excellent mechanical strength, and low dielectric constant.…”

“…[ 9,10 ] Therefore, most studies reported in recent years have focused on the high‐temperature resistant polymeric dielectric materials with excellent heat resistance and stability of thermal movement of molecular chains. [ 11–14 ] To develop various high‐temperature resistant, low dielectric constant, and low dielectric loss polymeric materials with different structures, many efforts have been done including the introduction of cross‐linked network into molecular chain [ 15–23 ] and the promotion of thermal conductivity. [ 24–26 ]…”