Preparation and Properties of Novel Cross‐Linked Fluorinated Poly(aryl ether) with Low Dielectric Constant and High Thermal Stability

Abstract

Fluorinated poly(aryl ether)s (FPAEs) have attracted much attention due to their high thermal stability, excellent mechanical strength, and low dielectric constant. High‐molecular‐weight fluorinated poly(aryl ether) containing phenylethynyl (FPAE‐PE) is successfully synthesized by nucleophilic substitution between 3‐ethynylphenol and FPAE. The cross‐linked fluorinated poly(aryl ether) (C‐FPAE‐PE) is prepared by thermal treatment of FPAE‐PE at 300 °C. The thermal stability, dynamic thermomechanical property, and dielectric performance of C‐FPAE‐PE are systematically studied. C‐FPAE‐PE has excellent heat resistance with 5% weight loss temperature (Td5%) at 490 °C in air and high thermomechanical properties with storage modulus retention of 50% at 215 °C. C‐FPAE‐PE displays low and steady dielectric constant of 2.4 and dielectric loss of 0.004 at 215 °C, exhibiting potential applications in the field of microelectronics, communication technology, and energy storage as high‐temperature low dielectric materials.

Polymer-based dielectrics with high permittivity and low dielectric loss for flexible electronics

“…In particular, the decrease in dielectric constant is not only due to the decrease in polar group density caused by the introduction of cross-linking agent, but also due to the restricted molecular chain movement and dipole switching. 62,95,109,112 For example, Wang et al 95 synthesized a series of novel cross-linked poly(2-(methylsulfonyl)ethyl methacrylate- co -glycidyl methacrylate) (poly(MSEMA- co -GMA)) by using reversible-addition fragmentation chain transfer (RAFT) polymerization and ring opening of epoxy groups. The dielectric constant of un-cross-linked polymer reached 12.1, which became 11.2 after cross-linking.…”

An ultralow-k dielectric derived from a fluorinated polybenzoxazole composite film with yolk–multishell mesoporous silica nanostructures

“…During recent decades, various polymer-based materials, [35][36][37][38][39][40] including epoxy resin, 41 poly(phenylene oxides) 42 and poly(aryl ether) 43 have received significant attention for low k applications. However, most of these low k polymers partially lose their thermal and dielectric stability when the temperature is up to 300 1C or higher.…”

Low-Dielectric Polymers Derived From Biomass

“…In general, there are two ways to reduce the dielectric constant ( D k ) of the polymer materials. One is reducing the dipole strength or the number of dipoles, i.e., reducing the overall polarizability of the polymer molecules by introducing low polarizability atoms or groups. − The other is increasing the free volume of the materials by introducing large-volume groups or increasing porosity. , …”