POSS and Other Hybrid Epoxy Polymers

Matějka, Libor

doi:10.1002/9783527628704.ch8

Cited by 4 publications

(2 citation statements)

References 50 publications

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“…In addition to that, polycomponent nanoheterogeneous systems are more likely to meet the stricter requirements for new multifunctional materials. These materials show improved properties compared with homogeneous ones [7]. The production of organic–inorganic nanocomposite materials has attracted a great attention because of the fact that they can combine the features of both organic polymers and inorganic ceramics.…”

Section: Introductionmentioning

confidence: 99%

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Epoxy/anhydride networks modified with polyhedral oligomeric silsesquioxanes

2012

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Epoxy/anhydride networks were modified, in the presence of benzyldimethylamine as catalyst, with two polyhedral oligomeric silsesquioxanes (POSS), whose inorganic framework had a compact and stable Si‐O core and an organic substituent shell. The influence of the content and type of POSS during curing and on the properties of the thermosets was investigated by thermal analysis and infrared spectroscopy. The curing kinetics was analyzed by means of an integral isoconversional nonisothermal procedure. When the POSS modifier was added, the storage modulus in the rubbery plateau increased and the glass transition temperature decreased because of the presence of the flexible organic moieties and the influence in the crosslinking density. The presence of these POSS structures hardly affected the thermodegradation behavior of cured materials. The dispersion of the POSS structures in the epoxy/anhydride matrix was good, but some submicron‐sized POSS agglomerates could be observed by transmission electron microscopy. POLYM. COMPOS., 2013. © 2012 Society of Plastics Engineers

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Section: Introductionmentioning

confidence: 99%

“…To what extent one of these possibilities influence depends on the POSS nanoparticle molar fraction, the degree of compatibility with the polymer matrix, and the tendency of the POSS to form a separate crystalline phase. Thus, the global properties of the final material are closely related to the morphology obtained [7].…”

Section: Introductionmentioning

confidence: 99%

Epoxy/anhydride networks modified with polyhedral oligomeric silsesquioxanes

2012

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High‐T_g, heat resistant epoxy–silica hybrids with a low content of silica generated by nonaqueous sol–gel process

Ponyrko

Kovářová

Kobera

et al. 2014

J of Applied Polymer Sci

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The epoxy-silica hybrids showing high T g and thermal stability are prepared by the non-aqueous sol-gel process initiated with borontriflouride monoethylamine. Tetramethoxysilane (TMOS) is used as a precursor of silica and 3-glycidyloxypropyl trimethoxysilane as a coupling agent to strengthen the interphase interaction with an epoxy matrix. The basic factors governing the nonaqueous sol-gel process are studied in order to reveal the formation-structure-properties relationships and to optimize the hybrid composition as well as conditions of the nonaqueous synthesis. The formation of the hybrid, its structure, thermomechanical properties and thermal stability are followed by chemorheology experiments, NMR, DMA and TGA. The most efficient reinforcement of the epoxy network is achieved by the combination of both alkoxysilanes, showing synergy effects. The hybrids with a low content ($10 wt %) of the in situ generated silica exhibit dramatic increase in T g and the high modulus, 335 MPa, up to the temperature 300 C.

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The effect of SiO2 filler content and its organic compatibility on thermal stability of epoxy resin

Afzal

Siddiqi

Iqbal

et al. 2012

J Therm Anal Calorim

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POSS and Other Hybrid Epoxy Polymers

Cited by 4 publications

References 50 publications

Epoxy/anhydride networks modified with polyhedral oligomeric silsesquioxanes

Epoxy/anhydride networks modified with polyhedral oligomeric silsesquioxanes

High‐T_g, heat resistant epoxy–silica hybrids with a low content of silica generated by nonaqueous sol–gel process

The effect of SiO2 filler content and its organic compatibility on thermal stability of epoxy resin

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POSS and Other Hybrid Epoxy Polymers

Cited by 4 publications

References 50 publications

Epoxy/anhydride networks modified with polyhedral oligomeric silsesquioxanes

Epoxy/anhydride networks modified with polyhedral oligomeric silsesquioxanes

High‐Tg, heat resistant epoxy–silica hybrids with a low content of silica generated by nonaqueous sol–gel process

The effect of SiO2 filler content and its organic compatibility on thermal stability of epoxy resin

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Product

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High‐T_g, heat resistant epoxy–silica hybrids with a low content of silica generated by nonaqueous sol–gel process