Polypyrrole as an interlayer for bonding conductive adhesives to activated aluminum bond pads

Kuechenmeister, Frank; Meusel, E.

doi:10.1109/95.558538

Cited by 11 publications

(5 citation statements)

References 2 publications

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“…Filled conducting polymer composites are used for electromagnetic shielding of computers and electronic equipments 4. In addition, they are used as conducting adhesives in electronics packaging, flip‐chips, cold solders, switching devices, static charge dissipating materials, and devices for surge protection 5–7. Low cost, lightweight, and flexible conducting polymer wires can be used for signal transmission in aviation as well as in land‐based electronics, having a lower cost and being a better alternative to pure metal‐conducting wires.…”

Section: Introductionmentioning

confidence: 99%

Submicron copper‐low‐density polyethylene conducting composites: Structural, electrical, and percolation threshold

Alvarez

Poblete

Pilleux

et al. 2006

J of Applied Polymer Sci

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Copper-embedded low-density polyethylene (LDPE) composites were fabricated using different copper concentrations in the polymer matrix. The copper particles were spherical with a mean particle size between 200 and 300 nm. All the samples were compacted under pressure and melted. The LDPE matrix was analyzed using gel permeation chromatography (GPC) and it did not evidence degradation of the LDPE matrix. The microstructure of the composites was examined with scanning electron microscopy. The electrical conductivity was measured as a function of the copper content, and the composite fabricated with a 10 vol % copper presented a conductivity 15 orders of magnitude higher than that of pure LDPE. The enhancement in conductivity can be explained by means of segregated percolation path theory and the experimental results are in agreement with the theoretical law.

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Section: Introductionmentioning

confidence: 99%

Submicron copper‐low‐density polyethylene conducting composites: Structural, electrical, and percolation threshold

Alvarez

Poblete

Pilleux

et al. 2006

J of Applied Polymer Sci

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“…TIns technique has the advantage to he conipatih!e with the aluminum metalhization, thus avoiding any post-processing on the pads of the circuitry chips other than the stud humping. The gold studs are used since adhesives usually cannot form strong bonds to the aluiinnurn nietallization wit hiout, pre-treatnient of the bonding pads [10]. The curing temperature of the adhesive is well below the soldering em perat lire, ensuring integrity oft he solder bump bond.…”

Section: Conductive Adhesive Bondingmentioning

confidence: 99%

<title>Integrated packaging concept for an intelligent transducer</title>

et al. 1998

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In this paper we present a stacking technology for an integrated packaging of an intelligent transducer which is formed by a micromachined silicon transducer and an integrated circuit chip. Transducer and circuitry are stacked on top of each other with an intermediate chip in between. The bonding of the transducer and the intermediate chip is done by flip chip solder bump bonding. The bonding between the above two-layer stack and the circuit chip is done by conductive adhesive bonding combined with gold studs. We demonstrate the stacking technologies on passive test chips rather than real devices and report on technological details.

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“…The process uses gold studs dip-coated in conductive adhesive [35]. The gold studs are used since adhesives usually cannot form strong bonds to the Al metalization without pretreatment of the bond pads [36]. The process of stud bump formation is the same as for conventional wire bonding.…”

Section: Conductive Adhesive Bondingmentioning

confidence: 99%

Multiple Through-wafer Interconnects for MEMS Applications

Heschel

Kuhmann²,

Bouwstra³

2001

Sensors Update

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This chapter reports on the design and manufacturing of multiple through-wafer interconnects for stacking of microelectromechanical devices. The feedthroughs have been applied to an interconnect (intermediate) layer for an integrated microphone. The integrated microphone consists of the transducer part and an application specific integrated circuit (ASIC). The two parts are joined by stacking them on top of each other with the interconnect (intermediate) layer between them. The intermediate layer is a multifunctional layer. It provides the microphone with an acoustic frontchamber. The intermediate layer ensures the interchange of acoustical and electrical signals with the environment. Also, the intermediate layer protects the microphone during dicing, chip handling and in operation. The two active components are electrically connected through the intermediate layer by multiple wafer frontside to backside interconnects. The feedthrough interconnects are provided with under bump metallizations (UBM), solder bumps and sealing rings on the microphone side and top surface metallizations (TSM) on the ASIC side. The entire metallization system is based on electroplating techniques. The patterning of the metallizations has been done utilizing an electrodepositable photoresist (EDPR) as a plating mold. Several EDPR processes have been developed which are optimized for the respective metallization. The feedthrough interconnects have been optimized in terms of series resistance and parallel capacitance. Electrical characterization of the feedthrough interconnects has been carried out analytically and experimentally. The series resistance of one single interconnect wire is in the order of 100 mX. The parallel (parasitic) capacitance is in the order of 2 pF. Coupling between two adjacent feedthrough interconnects is negligible for low relative humidity (<50%). For high relative humidity (>90%) the impedance between two wires may be reduced due to a condensed water film. Sensitivity measurements performed before and after bonding of the interconnect layer to the microphone showed identical results which proves sufficient (TX) isolation between the feedthrough wires.

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Polypyrrole as an interlayer for bonding conductive adhesives to activated aluminum bond pads

Cited by 11 publications

References 2 publications

Submicron copper‐low‐density polyethylene conducting composites: Structural, electrical, and percolation threshold

Submicron copper‐low‐density polyethylene conducting composites: Structural, electrical, and percolation threshold

<title>Integrated packaging concept for an intelligent transducer</title>

Multiple Through-wafer Interconnects for MEMS Applications

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