Abstract:Purpose
This paper aims to present investigation on textured polyimide (PI) substrate for enhanced light absorption in flexible black silicon (bSi).
Design/methodology/approach
Flexible bSi with thickness of 60 µm is used in this work. To texture the PI substrate, copper-seeding technique is used. A copper (Cu) layer with a thickness of 100 nm is deposited on PI substrate by sputtering. The substrate is then annealed at 400°C in air ambient for different durations of 60, 90 and 120 min.
Findings
With 90 mi… Show more
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