Polyimide–polydimethylsiloxane copolymers for low‐dielectric‐constant and moisture‐resistance applications

Xi, Kai; Meng, Zhen; Heng, Liang; Ge, Renjie; He, Hui; Yu, Xia; Jia, Xudong

doi:10.1002/app.30154

Cited by 25 publications

(13 citation statements)

References 95 publications

(113 reference statements)

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“…Incorporating nanoparticles into the polymer matrix are the most common method in producing these hybrid materials. Among the polymer matrices, aromatic polyimides (PIs) are a very promising class of high performance polymers owing to their high thermal stability, excellent mechanical, and electrical properties as well as excellent chemical resistance, and have been widely used for variety of applications such as electrics, coatings, composite materials, and membranes . Many PIs/inorganic nanocomposites have been explored in the literature and several methods are used to prepare PIs/inorganic nanocomposites, including sol‐gel processing, intercalation, and mechanical blend .…”

Section: Introductionmentioning

confidence: 99%

Development and characterization of co‐polyimide/attapulgite nanocomposites with highly enhanced thermal and mechanical properties

Zhang

Shen

et al. 2013

Polymer Composites

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A series of co-polyimide/attapulgite (co-PI/AT) nanocomposites have been successfully fabricated from anhydride-terminated polyimide (PI) and gaminopropyltriethoxysilane (APTES)-modified fibrous attapulgite (AT). Co-PI was prepared from 4,4 0 -diaminodiphenyl ether (ODA), 4,4 0 -oxydiphthalic anhydride (ODPA), and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) by using the method of chemical imidization. Different amount of AT (0, 1, 3, 5, 7 wt%) were introduced into co-PI via strong covalent interactions between terminal anhydride and amino groups. The properties of co-PI/AT nanocomposites such as morphology, thermal stability, mechanical properties, and UV transparency were investigated to illustrate the contribution of the introduction of AT into the PI matrix. FTIR spectra and SEM images revealed that network structures between co-PI and AT are formed, which endowed the nanocomposites with outstanding thermal and mechanical properties. The co-PI/AT nanocomposites exhibited excellent thermal and thermo-oxidative stabilities with the onset decomposition temperature and 10% weight loss temperature increasing to the ranges of 502-510 C and 555-562 C from 480 C to 526 C for the pristine co-PI, respectively. The glass transition temperatures of these co-PI/AT nanocomposites increased to the range of 231-238 C from 222 C for pure co-PI. The co-PI/AT nanocomposites films were found to be transparent, flexible, and tough. By incorporating 5 wt% AT into the co-PI matrix, the tensile strength, elongation at break, and Young's modulus of the co-PI/AT nanocomposites reached 110.7 MPa, 14.5%, and 1.2 GPa, respectively, which are 50%, 120%, and 80% increased compared with the values of pristine PI. POLYM. COMPOS., 35:86-96, 2014.

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Section: Introductionmentioning

confidence: 99%

Development and characterization of co‐polyimide/attapulgite nanocomposites with highly enhanced thermal and mechanical properties

Zhang

Shen

et al. 2013

Polymer Composites

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“…15,23 The inclusion of silicon linkages has been reported to improve oxidative stability and flammability of high-temperature polymers. [24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39] As oxygen and free radicals cleave carbon-silicon (C-Si) bonds, siloxy units are formed. These siloxy moieties may interact to produce an inert phase, which can reduce the rate of degradation of the surface and the rate of diffusion of oxygen into the bulk.…”

Section: Introductionmentioning

confidence: 99%

“…Specifically, the addition of silicon linkages has been shown to improve the oxidative stability of polymers similar to phthalonitriles, including cyanate esters [24][25][26] and polyimide materials. [29][30][31][32][33][34][35][36][37][38][39] In many of these polymers reported in literature, the silicon linkage is attached to the aromatic backbone via a methylene bridge. However, methylene and benzylic groups in the backbone should be avoided for optimum thermal stability.…”

Section: Introductionmentioning

confidence: 99%

Thermal and oxidative behavior of a tetraphenylsilane-containing phthalonitrile polymer

Monzel

Lü

Pruyn

et al. 2018

High Performance Polymers

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Phthalonitrile polymers have potential for high-temperature applications in polymer matrix composites as electronic encapsulation compounds. To investigate the effect of inclusion of an organosilicon moiety, a tetraphenylsilane-containing phthalonitrile monomer was synthesized in high yields. The monomer possessed a high melting point of 222–223°C, while no hydrolytic sensitivity was observed. Cured polymers exhibited glass transitions in the range of 290–325°C and coefficients of thermal expansion of 73–77 µm/(m °C). In thermogravimetric analysis (TGA), 5 wt% loss was observed at 482–497°C and 519–526°C, under air and nitrogen, respectively. Infrared (IR)-TGA of evolved gases revealed multiple degradations in both nitrogen and air. The material possessed good thermo-oxidative stability (TOS) when aged in air at 250°C. After aging for 5000 h, oxidative degradation was characterized using Fourier transform IR microscopy, energy dispersive spectroscopy, optical microscopy, and Knoop hardness testing. Four zones were identified in aged samples. The cleavage of Si-phenyl bonds and the formation of Si–O phases and carbonyl groups were observed.

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“…The methods for preparation of low dielectric constant PI materials mainly compose of producing pores in PI membranes and introducing low polar and large volume structural units to the polymer chains, such as cyclohexane, adamantine, silane, and fluorine containing units . In the former methods, addition pore‐containing fillers, solvent etching fillers, and pyrolysis heat instable polymer or block in PI matrix, such as PEO, PPO, PS, PMMA, and PCL, are commonly used .…”

Section: Introductionmentioning

confidence: 99%

Thermal and dielectric properties of electrospun fiber membranes from polyimides with different structural units

Liu

Ding

et al. 2015

J of Applied Polymer Sci

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In this work, electrospinning technique was used to prepare low dielectric constant membranes. First, three kinds of polyimide (PI) fiber membranes were fabricated by electrospinning of poly(amic acid) (PAA) solutions which are from polycondensation of 4,4 0 -oxidianiline (ODA) and three dianhydrides, pyromellitic dianhydride (PMDA), 2,2 0 -bis(3,4-dicarboxyphenyl) hexafluropropane dianhydride (6FDA) and 1,2,4,5-cyclohexanetetracarboxylic dianhydride(HPMDA), followed by imidization at higher temperature. The relationship of the fiber morphology, thermostability and dielectric properties of the membranes with the polymer structure were discussed. Under the same conditions, PAAs with more flexible structure are easier to form low viscosity solution and fabricate high pore fraction membranes which are low dielectric constant materials. Under the coupling effect of fluorine-containing groups and contribution of pores, the dielectric constant of 6FDA-containing PI is lowered to 1.21 at 1 KHz with lower dielectric loss which accords with the calculated one. Also the 5% weight loss temperature of the three kinds of PIs is all higher than 4008C. The formed electrospun membranes are thermostable low dielectric constant materials.

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Polyimide–polydimethylsiloxane copolymers for low‐dielectric‐constant and moisture‐resistance applications

Cited by 25 publications

References 95 publications

Development and characterization of co‐polyimide/attapulgite nanocomposites with highly enhanced thermal and mechanical properties

Development and characterization of co‐polyimide/attapulgite nanocomposites with highly enhanced thermal and mechanical properties

Thermal and oxidative behavior of a tetraphenylsilane-containing phthalonitrile polymer

Thermal and dielectric properties of electrospun fiber membranes from polyimides with different structural units

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