Thermal and dielectric properties of electrospun fiber membranes from polyimides with different structural units

Li, Penggang; Liu, Leipeng; Ding, Ling; Lv, Fengzhu; Zhang, Yihe

doi:10.1002/app.43081

Cited by 12 publications

(3 citation statements)

References 43 publications

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“…A reduction in molecule molar polarizability and an increase in free polymer volume are the main ways to reduce the dielectric constant. Several strategies have been developed to achieve this purpose; these include blending porous inorganic matter into a PI matrix and developing monomers with fluorine-containing groups or an asymmetric structure. − PI films with κ values as low as 3.04 have been developed by using monomer 4,4′-(hexafluoroisopropylidene) diphthalic anhydride with a small dipole polarization of the C–F band . Tsai et al developed an asymmetric monomer; its high steric hindrance decreased the dielectric constant of the corresponding PI to 2.72 .…”

Section: Introductionmentioning

confidence: 99%

Low Dielectric Constant Polyimide Hybrid Films Prepared by in Situ Blow-Balloon Method

Zhao

Zhu

Tong

et al. 2019

ACS Appl. Polym. Mater.

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Insulating materials with a low dielectric constant and a low dielectric loss are in high demand to meet requirements of the continuous miniaturization of electronic devices and high speed information transmission. We fabricated porous polyimide/reduced graphene oxide (PI/rGO) hybrid films with an ultralow dielectric constant and a low dielectric loss via a facile “blow-balloon” method. Poly(ethylene glycol) (PEG) was used as a pore-forming agent by mixing with polyamide acid carboxylate (PAAC) and GO in water. The ternary mixture of PAAC/GO/PEG formed a hydrogel and dried naturally into a xerogel film. Porous PI/rGO films were obtained by in situ thermal pyrolysis of PEG through heating PAAC/GO/PEG hybrid films to 400 °C. The homogeneous porous structure could be regulated easily by adjusting the mass ratio of PEG to PAAC/GO. The porous structure inside the hybrid films prepared by the hydrogel method provided the PI/rGO films with an ultralow dielectric constant (κ) as low as 1.9 and a high ductility with an average elongation at break above 38%. This porous PI/rGO film with an ultralow κ value may be a promising candidate for next-generation interlayer dielectrics.

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Section: Introductionmentioning

confidence: 99%

Low Dielectric Constant Polyimide Hybrid Films Prepared by in Situ Blow-Balloon Method

Zhao

Zhu

Tong

et al. 2019

ACS Appl. Polym. Mater.

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“…The FPI UFMs were fabricated via a one-step electrospinning procedure reported in the literature [ 39 ]. FPI-5 UFM was used as an example to present the detailed procedure.…”

Section: Methodsmentioning

confidence: 99%

Molecular Design, Preparation, and Characterization of Fluoro-Containing Polyimide Ultrafine Fibrous Membranes with High Whiteness, High Thermal Stability, and Good Hydrophobicity

Pan

Hanli

et al. 2022

Molecules

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Polymeric ultrafine fibrous membranes (UFMs) with high thermal stability and high whiteness are highly desired in modern optoelectronic applications. A series of fluoro-containing polyimide (FPI) UFMs with high whiteness, good thermal stability, and good hydrophobicity were prepared via a one-step electrospinning procedure from the organo-soluble FPI resins derived from a fluoro-containing dianhydride, 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA), and various diamines containing either pendant trifluoromethyl (–CF3) groups or alicyclic units in the side chains. The obtained FPI UFMs, including FPI-1 from 6FDA and 3,5-diaminobenzotrifluoride (TFMDA), FPI-2 from 6FDA and 2′-trifluoromethyl-3,4′-oxydianiline (3FODA), FPI-3 from 6FDA and 1,4-bis[(4-amino-2-trifluoromethyl)phenoxy]benzene (6FAPB), FPI-4 from 4,4′-bis[(4-amino-2-trifluoromethyl)phenoxy]biphenyl (6FBAB), and FPI-5 from 6FDA and 4’-tert-butyl-cyclohexyl-3,5-diaminobenzoate (DABC) showed whiteness indices (WI) higher than 87.00 and optical reflectance values higher than 80% at the wavelength of 457 nm (R457), respectively. The FPI-5 UFM, especially, showed the highest WI of 92.88. Meanwhile, the prepared PI UFMs exhibited good hydrophobic features with water contact angles (WCA) higher than 105°. At last, the PI UFMs exhibited good thermal stability with glass transition temperatures (Tg) higher than 255 °C, and the 5% weight-loss temperatures (T5%) higher than 510 °C in nitrogen.

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“…By adding pores to rigid polymer films, the density can be substantially reduced. Several studies have been conducted on low dielectric PIs such as nanoporous PI, 18,19 PI aerogels, 20 and PI composites, 21,22 which successfully reduced the dielectric constant to 1.70 23–27 . However, due to the brittle pores, those porous films obviously lost their mechanical toughness and thermal stability, and the porosity of polymer films generally led to an increase in water absorption, which remains an issue during the following manufacturing phases and applications 28–31 .…”

Section: Introductionmentioning

confidence: 99%

Construction of fluorenyl‐modified low dielectric constant polyimide films with excellent mechanical properties and optical transparency

Xie,

Li,

Zhao

et al. 2024

J of Applied Polymer Sci

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In order to meet the requirements of highly integrated and miniaturized electronic components, there is an urgent need for low dielectric materials with high mechanical properties and optical transparency in the field of microelectronics. In this study, a series of novel polyimide films (FPI) containing fluorenyl were prepared, and the effects of the fluorenyl content on the thermal, mechanical, and dielectric properties of the copolymerized films were investigated and discussed. The results demonstrate a significant decrease in the dielectric constant of the FPI films following the introduction of fluorenyl into polyimide (PI) chain segment. The FPI films also exhibited high mechanical properties, including tensile strengths between 92 and 106 MPa and elongation at break in the range of 8.4%–13.0%. Additionally, the introduction of the noncoplanar fluorenyl considerably improved the optical transparency and solubility of the FPI film. It is noteworthy that the FPI‐3 has the best dielectric properties, with a low dielectric constant of 2.61 at 10 MHz and shows low water absorption (0.49%). The results show that we have prepared a novel low dielectric PI material film with excellent mechanical properties and optical transparency by introducing fluorenyl into the PI chain segment. These FPI films with satisfactory properties may be good candidates for dielectric materials for electronic components.

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Thermal and dielectric properties of electrospun fiber membranes from polyimides with different structural units

Cited by 12 publications

References 43 publications

Low Dielectric Constant Polyimide Hybrid Films Prepared by in Situ Blow-Balloon Method

Low Dielectric Constant Polyimide Hybrid Films Prepared by in Situ Blow-Balloon Method

Molecular Design, Preparation, and Characterization of Fluoro-Containing Polyimide Ultrafine Fibrous Membranes with High Whiteness, High Thermal Stability, and Good Hydrophobicity

Construction of fluorenyl‐modified low dielectric constant polyimide films with excellent mechanical properties and optical transparency

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