Polyimide-Epoxy Composites

Abstract

Both polyimides and epoxy have found widespread use in many diverse industries. Polyimides, due to their excellent thermal and chemical stability and low dielectric constant, have become a favorite of the electronics industry. This broad class of polymers has found widespread use in a variety of electronic applications and the low cost has made epoxy popular as matrix materials in composites, adhesives and coatings.Both polyimide and epoxy possess a number of unusually valuable characteristics that make them amenable for use in a vast array of applications. Until quite recently, however, the two compounds have not been concurrently fabricated into a material that combines their desirable properties. Recently advances in polyimide solubility and have made the fabrication of polyimide-epoxy composites possible. This chapter reports the various fabrication strategies and problems encountered in synthesis and characterization of the formed composites and opens up the possibility of further endeavor in this field of research.

Synthesis and characterization of epoxy-anhydride polymers modified by polyfluoroaromatic oligoimides

“…The solution obtained was kept at this temperature until starting material was consumed (15-25 h); the degree of conversion was monitored using 19 F NMR. Acetic anhydride was added (1.4 mol) and the mixture was kept under the same conditions for 5-6 h. Solvents were distilled off under reduced pressure and the pasty mass obtained was dried in a vacuum oven (10)(11)(12)(13)(14)(15) …”

“…For these purposes, micro-and nanoscale inorganic dopants (oxides, carbides, and nitrides of aluminum, silicon, and boron [3][4][5][6][7], nanocarbon in various forms [7][8][9][10], etc.) and thermoplastics (polyesters [11,12], polysiloxanes [13], polyimides [14,15]) are used.…”

Prototype for Automatable, Dielectrophoretically-Accessed Intracellular Membrane–Potential Measurements by Metal Electrodes

“…It has to be emphasized that the epoxy resin used for insulation of the single-spike electrode is chemically inert and is an excellent electrical insulator. 40 However, no sealing between the epoxy resin and membranes was observed; thus it was necessary to isolate the electrode-solution interface by liposomes. Similarly to other devices based on the planar patch-clamp technique, the seal resistance measurement (also by impedance spectroscopy) could offer a standard output to gauge cell health.…”

Spontaneous Three‐Layer Formation in the Curing of Polyimide/Epoxy Blends

“…However, epoxy resins are inherently brittle, which necessitates the toughening by mixing other materials with them in various industrial uses. [1][2][3] Aromatic polyimide, which has a high glass transition temperature and high mechanical and thermal stability, has been used as a toughener, [4][5][6][7][8] and the cure kinetics, domain structures, and phase separation mechanisms have been studied for several polyimide-toughened epoxies by varying curing temperature, [9,10] initial concentration, [11,12] and molecular weight. [13] Fluorinated polyimide, which has a low dielectric constant and generally high thermal stability even under oxygen atmosphere, is expected to be a useful toughener, but an epoxy resin toughened by fluorinated polyimide has not been studied so far within our knowledge.…”