Polyethersulfone‐epoxy terminated materials as thermosetting resins for microelectronic devices

Abstract

A totally aromatic polyether/sulfone resin (PES‐E) was synthesized and tested as an insulating glue in the construction of a Chip‐on‐Chip (CoC) device. PES‐E, essentially constituted of open‐chain macromolecules of low molecular mass (Mn of about 3000 Da) with hydroxy and/or epoxy end‐groups, has a glass transition temperature of about 150 °C and is subject to crosslinking at temperatures higher than 320 °C. A CoC device was assembled using a five‐step process by interposing a layer of PES‐E between two chips. After curing, SEM cross section images showed a homogeneous crosslinked resin layer well stuck (flick and shear tests) to both chips. The chemical structure of the chains and the hydroxy/epoxy end‐groups ratio were optimized to obtain a crosslinked material with good adhesion and sufficient flexibility to avoid cracking during assembly and use. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 5682–5689, 2009

Synergistic effects of short glass fiber/short carbon fiber hybrids on the mechanical properties of polyethersulfone composites

“…In addition, PES possesses great flame retardancy, low creep, high dielectric strength, extraordinary dimensional stability, and chemical resistance . With these fascinating properties, PES is highly attractive in the fields of water separation, medical instruments, microelectronics, automobile, aerospace, and so on . Importantly, due to its high thermal stability, PES is highly promising as a tribo‐polymer for high temperature environment .…”

Phosphorus‐Containing Polysulfones

“…Engineering thermoplastics based on PSF have been widely used to overcome the problems associated with the brittleness or flame resistance of epoxy resins [29][30][31][32][33].…”

Synthesis and characterization of sulfonated copolyethersulfones

“…Polyethersulfones are a class of polyaromatics of high importance for special applications which includes toughening modifiers for epoxy resins,1, 2 adhesives for metal to metal bonding,3 membranes for separate gaseous and solid substances4 and membranes for fuel cells 5, 6. The latter application is of increasing interest for the industrial exploitation of fuel cells with improved properties.…”

“…The progress of the postcondensation reaction has been followed by 1 H NMR and MALDI-TOF MS analyses. The MALDI-TOF MS results U 1682.4 (4,2); 1914.6(5,2); 2146.8 (6,2); 2379.0 (7,2); 2611.2 (8,2); 2843.4 (9,2); 3075.6 (10,2); 3307.8 (11,2); 3540.0 (12,2); 3772.2 (13,2)…”

“…A 1700.4 (4,2); 2076.7 (4,3); 1932.6 (5,2); 2308.9 (5,3); 2164.8 (6,2); 2541.1 (6,3); 2397.0 (7,2); 2773.3 (7,3); 2619.2 (8,2); 3005.5 (8,3); 2861.4 (9,2); 3237.7 (9,3); 3093.6 (10,2); 3469.9 (10,3); 3325.8 (11,2); 3702.1 (11,3); 3558.0 (12,2); 3934.3 (12,3); 3790.2 (13,2); 4166.5 (13,3) B 1718.4 (4,1); 2094.7 (4,2); 1950.6 (5,1); 2326.9 (5,2); 2182.8 (6,1); 2559.1 (6,2); 2415.0 (7,1); 2791.3 (7,2); 2637.2 (8,1); 3023.5 (8,2); 2879.4 (9,1); 3255.7 (9,2); 3111.6 (10,1); 3487.9 (10,2); 3343.8 (11,1); 3720.1 (11,2); 3576.0 (12,1); 3952.3 (12,2); 3808.2 (13,1); 4184.5 (13,2) C 1736.4 (4,0); 2112.7 (4,1); 1968.6 (5,0); 2344.9 (5,1); 2200.8 (6,0); 2577.1 (6,1); 2433.0 (7,0); 2809.3 (7,1); 2655.2 (8,0); 3041.5 (8,1); 2897.4 (9,0); 3273.7 (9,1); 3129.6 (10,0); 3505.9 (10,1); 3361.8 (11,0); 3738.1 (11,1); 3594.0 (12,0); 3970.3 (12,1); 3826.2 (13,0); 4202.5 (13,1) a n ¼ x þ y; for each structure is also reported the respective pertinent equation to calculate the corresponding molecular mass (M), considering that the mass of PES and indicate that the copolymers chains terminated with chlorine groups decrease with respect to those ended with phenol groups at both ends, confirming the progress of the condensation reaction. MALDI TOF mass spectra (not reported here for brevity) show homogeneous cluster of peaks ranging from m/z 2000 to m/z 26,000, indicating that the MMD of the copolymers increase, as expected.…”