Design
of organic π-conjugated semiconducting materials is
an exciting avenue of research that has already found promising applications
in a wide variety of fields, ranging from stretchable electronics
to bioimaging and theranostics. With favorable optoelectronic and
thermomechanical properties, these materials and related devices can
provide a complementary alternative to commercial silicon-based electronics.
One of the most important features of organic semiconductors is their
ability to be solution processed, allowing access to a wide variety
of printing and solution deposition techniques inaccessible to silicon.
However, the solution processability of these materials also poses
challenges for the development of multilayer electronics due to potential
problems such as swelling, film deformation and interfacial mixing
that can occur upon successive solution deposition. Use of orthogonal
(noncompatible) solvents and solvent-free deposition methods have
been extensively investigated as solutions to this challenge, although
the applicability of these approaches is limited by the chemical properties
of the materials used. Another approach to address this problem is
to focus on the materials rather than deposition methods. Through
rational design, functional groups can be used to create triggered
solvent resistance through covalent or dynamic intermolecular bonds.
Design strategies include the incorporation of photo- and thermally
cleavable functional groups in the materials, or the use of chemical
additives/reagents to significantly alter the solubility of π-conjugated
materials and afford solvent-resistant thin films. This spotlight
article presents recent progress toward solvent-resistant organic
materials with an emphasis on their use in electronic applications.
Recent and key developments will be discussed from a personal perspective,
providing an overview of the different approaches used to achieve
solvent-resistant semiconducting materials toward the fabrication
of advanced, multilayer organic electronics.